A kind of carbon fiber composite felt and method for enhancing thermal conductivity and electrical conductivity of polymer composite material

Abstract

The invention provides a carbon fiber composite felt and a method for enhancing the thermal conductivity and electrical conductivity of a polymer composite material. First, carbon fibers are formed in an air flow net to form a layer-by-layer carbon fiber soft felt, acupuncture in the upper and lower directions, and a layer of organic matter It is wrapped on the surface of carbon fiber, and then carbonized at high temperature to obtain a carbon fiber / carbon composite hard felt, which is chemically plated to obtain a carbon fiber composite felt with a metal-carbon-carbon fiber three-layer fiber structure, and finally compresses the carbon fiber composite felt according to a certain proportion. Its arrangement is more dense. After the polymer prepolymer is impregnated under vacuum, the composite material is obtained by high temperature curing and annealing; the carbon fiber composite felt has a multi-level structure similar to "cable" or "sesame chocolate bar", which can be Abundant high-efficiency thermal and electrical pathways are formed in the composite material, which significantly improves the thermal conductivity and electrical conductivity of the polymer, and meets the heat dissipation requirements of today's electronic and electrical equipment.

Description

technical field [0001] The invention belongs to the technical field of preparation of thermally conductive and electrically conductive composite materials, and relates to a carbon fiber composite felt and a method for enhancing the thermal and electrical conductivity of polymer composite materials. Background technique [0002] With the rapid development of microelectronic integration and assembly technology, the higher and higher requirements for high voltage in the field of electrical and electrical insulation, and the rapid development of other related fields, the volume of electronic components and logic circuits has been reduced by tens of millions of times, while the When the working frequency increases sharply, the heat generated by the electronic equipment accumulates and increases rapidly, and the working environment temperature also changes rapidly to the direction of high temperature. In order to ensure the normal operation of electronic components with high relia...

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Problems solved by technology

Thermally conductive materials such as high heat dissipation interface materials and housing materials used in electronics and electrical appliances often need to have excellent electromagnetic shielding and mechanical properties to meet their use requirements. LED lighting requires copper clad substrates with good heat dissipation performance, otherwise LEDs cannot dissipate their own heat in time. Cause serious light decay and cause product scrap

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