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Laminate for manufacturing flexible display, and flexible display manufacturing method using same

A flexible display and laminate technology, applied in chemical instruments and methods, lamination, application, etc., can solve the problems of complicated process, complicated manufacturing process, increased manufacturing cost, etc., and achieve the effect of promoting separation and minimizing problems

Active Publication Date: 2020-07-17
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the manufacturing process of the related art, the device structure may be affected during irradiation of laser light or light, so that defects may occur, and in addition, equipment for laser light or light irradiation and another process are required
Therefore, the entire manufacturing process of the device is complicated and the manufacturing cost is also greatly increased
[0008] In addition, due to the insufficient adhesion between the a-Si sacrificial layer and the flexible substrate, it is often necessary to form a separate adhesive layer between the sacrificial layer and the flexible substrate, which may complicate the whole process.
In addition, due to the need for laser or light irradiation under harsher conditions, there are growing concerns that may adversely affect the reliability of devices

Method used

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  • Laminate for manufacturing flexible display, and flexible display manufacturing method using same
  • Laminate for manufacturing flexible display, and flexible display manufacturing method using same
  • Laminate for manufacturing flexible display, and flexible display manufacturing method using same

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0128] Polymerization of polyimide BPDA-pPDA (98.9:100)

[0129] After 100 g of NMP (N-methyl-2-pyrrolidone) was charged into the reactor with nitrogen flow, 6.243 g (57.726 mmol) of p-phenylenediamine (p -PDA) dissolves. At the same temperature, 16.797 g (57.091 mmol) of 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA) and 56.96 g of NMP were added to the solution of p-PDA, and stirred for a predetermined time. time to polymerize the polyamic acid, thereby preparing a polyimide precursor.

[0130] An organic solvent was added in such an amount that the solid concentration of the polyimide precursor prepared by the reaction was 12.8% by weight to prepare a polyimide precursor solution.

preparation example 2

[0131] Polymerization of polyimide BPDA-PMDA-pPDA (88.9:10:100)

[0132] After 100 g of NMP (N-methyl-2-pyrrolidone) was charged into the reactor with nitrogen flow, 6.364 g (58.849 mmol) of p-phenylenediamine (p -PDA) dissolves. At the same temperature, 15.393g (52.316mmol) 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA), 1.289g (5.885mmol) pyromellitic dianhydride (PMDA) and 56.96 g of NMP were added to the solution of p-PDA, and stirred for a predetermined time to polymerize polyamic acid, thereby preparing a polyimide precursor.

[0133] An organic solvent was added in such an amount that the solid concentration of the polyimide precursor prepared by the reaction was 12.8% by weight to prepare a polyimide precursor solution.

preparation example 3

[0134] Polymerization of polyimide BPDA-pPDA-TFMB (98.9:90:10)

[0135] After 100 g of NMP (N-methyl-2-pyrrolidone) was charged into the reactor with nitrogen flow, 5.335 g (49.332 mmol) of p-phenylenediamine (p -PDA) and 1.775 g (5.481 mmol) of bistrifluoromethylbenzidine (TFMB) were dissolved. At the same temperature, 15.950 g (54.221 mmol) of 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA) and 56.96 g of NMP were added to the solution of p-PDA and TFMB, and The polyamic acid is polymerized by stirring for a predetermined time, thereby preparing a polyimide precursor.

[0136] An organic solvent was added in such an amount that the solid concentration of the polyimide precursor prepared by the reaction was 12.8% by weight to prepare a polyimide precursor solution.

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Abstract

The present invention employs a polyimide film, which has a coefficient of thermal expansion (CTE) that is a negative number at a temperature equal to or greater than 350 DEG C, as a debonding layer for separating a flexible substrate and a carrier substrate, and thus can easily separate a flexible substrate from a carrier substrate by using a detaching phenomenon caused by a difference in residual stress between the flexible substrate and the debonding layer after a high-temperature process for producing an element on the flexible substrate. Therefore, the present invention can separate the flexible substrate without causing chemical or physical damage to the element formed on the flexible substrate, thereby minimizing problems that may occur during a stripping process.

Description

technical field [0001] This application claims the benefit of priority from Korean Patent Application No. 10-2018-0108219 filed on September 11, 2018, the entire disclosure of which is incorporated herein by reference. [0002] The present invention relates to laminates having a release layer capable of facilitating separation of a flexible substrate from a carrier substrate and methods of making flexible displays using the same. Background technique [0003] The display device market is rapidly changing its focus to large-sized, thinned and lightweight flat panel displays (FPDs). Such flat panel displays include liquid crystal displays (LCDs), organic light emitting displays (OLEDs), or electrophoretic devices. [0004] In particular, in recent years, in order to further expand the applications and uses of such flat panel displays, attention has been focused on so-called flexible display devices using flexible substrates. The application of flexible display devices to mob...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/06B32B27/28
CPCB32B17/06B32B7/06B32B2379/08H01L27/1266C08G73/1067C08G73/1039C08G73/1042B32B43/006H10K71/80H10K59/1201H10K2102/311B32B27/281B32B2457/20B32B17/10B32B3/30B32B17/101B32B17/10568B32B17/10697B32B38/10C08G73/1007H01L27/1262B32B2305/72B32B2307/30B32B2307/546H10K59/1213
Inventor 朴珍永李珍昊朴彩媛
Owner LG CHEM LTD
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