Water treatment epoxy pouring sealant for preventing hollow fiber membrane from discoloring and preparation method thereof
A fiber membrane and water treatment technology, which is applied in the direction of epoxy resin glue, osmosis/dialysis water/sewage treatment, general water supply saving, etc., can solve the problems of discoloration, improve bonding performance, shorten gel time, and improve work efficiency efficiency effect
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Embodiment 1
[0045] Mix and stir 91.5 parts by weight of E51, 5 parts by weight of carbon 12-14 alkyl glycidyl ether (AGE), 2 parts by weight of EP4000, 0.9 parts by weight of KH-560, and 0.6 parts by weight of defoamer to obtain A Component;
[0046] 14.15 parts by weight of modified ring amine JH-5933, 34.4 parts by weight of polyetheramine D230, 30 parts by weight of polyetheramine T403, 5.95 parts by weight of polyamide 651, 15 parts by weight of salicylic acid, 0.5 parts by weight BYK-337, stirred and mixed at 75°C for 5h, cooled to room temperature to obtain component B;
[0047] Mix and stir components A and B at a weight ratio of 100:40 to obtain a membrane module potting compound.
Embodiment 2
[0049] 67.5 parts by weight of E51, 25 parts by weight of N170, 3 parts by weight of neopentyl glycol diglycidyl ether, 3 parts by weight of 1,2-cyclohexanediol diglycidyl ether, 2 parts by weight of carboxyl-terminated butyl Nitrile rubber synthetic epoxy resin, 0.9 parts by weight of KH-560, and 0.6 parts by weight of defoamer are mixed and stirred evenly to obtain component A;
[0050] 17.15 parts by weight of modified ring amine JH-5933, 34.4 parts by weight of polyetheramine D230, 34 parts by weight of polyetheramine T403, 5.75 parts by weight of polyamide 651, 8 parts by weight of salicylic acid, 0.7 parts by weight BYK-306, stirred and mixed at 75°C for 5h, cooled to room temperature to obtain component B;
[0051] Mix and stir components A and B at a weight ratio of 100:45 to obtain a membrane module potting compound.
Embodiment 3
[0053] With the E44 of 70.5 parts by weight, the N170 of 15 parts by weight, the neopentyl glycol diglycidyl ether of 5 parts by weight, the hexanediol diglycidyl ether of 6 parts by weight, the polyurethane modified epoxy resin of 2 parts by weight, 0.9 KH-560 in parts by weight and 0.6 parts by weight of defoamer are mixed and stirred evenly to obtain component A;
[0054] 14.15 parts by weight of modified cyclic amine JH-5933, 31.4 parts by weight of polyetheramine D230, 28 parts by weight of polyetheramine T403, 5.95 parts by weight of polyamide 651, 20 parts by weight of salicylic acid, 0.5 parts by weight BYK-341, stirred and mixed at 75°C for 5h, cooled to room temperature to obtain component B;
[0055] Mix and stir components A and B at a weight ratio of 100:35 to obtain a membrane module potting compound.
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