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Improved adhesive product

An adhesive, an improved technology, used in adhesives, conductive adhesives, film/sheet adhesives, etc., can solve the problems of poor performance stability of the adhesive layer, abnormal appearance, large thickness tolerance of the adhesive layer, etc. The effect of flatness, resolution of mottled, and uniform thickness

Pending Publication Date: 2020-07-28
江苏晶华新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the electronics industry, the release layer of conductive tape generally uses PEK double-sided release paper with different release force on both sides. Because the paper is thick and relatively soft, it is very suitable for producing conductive tapes with thicker thickness or light-colored rubber surface. It can effectively solve the appearance problems of the rubber surface caused by the protruding rubber surface of the conductive material after winding; but with the development of the electronic industry towards lightness and thinning, the thickness of the required conductive tape is getting thinner and the conductivity is getting better and better. High, the amount of conductive powder added will increase accordingly, and the color of the adhesive surface will also deepen accordingly; at this time, the disadvantages of the large thickness tolerance and poor surface flatness of PEK double-sided release paper will be fully reflected, resulting in the thickness of the adhesive layer Large tolerances, spots on the rubber surface and a large number of white spots lead to poor performance stability and abnormal appearance of the rubber layer
At this time, when using a double-sided release film with a difference in release force on both sides as the release layer, there will also be problems with the conductive powder protruding and causing the rubber surface to be glued.

Method used

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  • Improved adhesive product

Examples

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Effect test

Embodiment 1

[0025] This embodiment provides an improved adhesive product, including a composite release paper and a conductive adhesive layer coated thereon, and the composite release paper sequentially includes a first release layer, a first coating layer, a substrate, The second coating layer and the second release layer. The coating grammage of the first coating layer is 15g / m 2 , the coating grammage of the second coating layer is 25g / m 2 .

Embodiment 2

[0027] This embodiment provides an improved adhesive product, including a composite release paper and a conductive adhesive layer coated thereon, and the composite release paper sequentially includes a first release layer, a first coating layer, a substrate, The second coating layer and the second release layer. The coating grammage of the first coating layer is 30g / m 2 , the coating grammage of the second coating layer is 45g / m 2 .

Embodiment 3

[0029] This embodiment provides an improved adhesive product, including a composite release paper and a conductive adhesive layer coated thereon, and the composite release paper sequentially includes a first release layer, a first coating layer, a substrate, The second coating layer and the second release layer. The coating grammage of the first coating layer is 15g / m 2 , the coating grammage of the second coating layer is 35g / m 2 .

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Abstract

The invention discloses an improved adhesive product. The improved adhesive product comprises a composite release paper and a conductive adhesive layer coated on the composite release paper, the composite release paper sequentially comprises a first release layer, a first lamination layer, a base material, a second lamination layer and a second release layer, the coating gram weight of the first lamination layer is 15-30g / m<2>, and the coating gram weight of the second lamination layer is 25-50g / m<2>. The improved adhesive product provided by the invention effectively improves the flatness ofa glued surface, solves the problem of spots after gluing, also solves the problem of glue flowers formed by bulges of conductive particles after rolling, and is uniform in overall adhesive tape thickness and relatively small in tolerance.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to an improved adhesive product. Background technique [0002] In the electronics industry, the release layer of conductive tape generally uses PEK double-sided release paper with different release force on both sides. Because the paper is thick and relatively soft, it is very suitable for producing conductive tapes with thicker thickness or light-colored rubber surface. It can effectively solve the appearance problems of the rubber surface caused by the protruding rubber surface of the conductive material after winding; but with the development of the electronic industry towards lightness and thinning, the thickness of the required conductive tape is getting thinner and the conductivity is getting better and better. High, the amount of conductive powder added will also increase, and the color of the adhesive surface will also deepen accordingly; at this time, the disadvantages of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/40C09J9/02
CPCC09J7/403C09J7/405C09J9/02
Inventor 谷啸湘光忠明周晓南
Owner 江苏晶华新材料科技有限公司