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Core shell with various filler materials for enhanced thermal conductivity

A technology of material properties, casings, applied in the field of casings of electronic equipment, which can solve the problem of not providing the best performance level

Active Publication Date: 2020-08-04
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Certain materials may provide a desired level of performance with respect to some properties, but may not provide an optimum level of performance with respect to other properties

Method used

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  • Core shell with various filler materials for enhanced thermal conductivity
  • Core shell with various filler materials for enhanced thermal conductivity
  • Core shell with various filler materials for enhanced thermal conductivity

Examples

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Embodiment Construction

[0034] This description provides examples, and does not limit the scope, applicability or configuration set forth in the claims. Therefore, it should be understood that changes may be made in the function and arrangement of elements discussed, and that various embodiments may omit, substitute or add other procedures or components as appropriate without departing from the spirit and scope of the present disclosure. For example, the methods described may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with respect to some embodiments may be combined in other embodiments.

[0035] One aspect of the present disclosure relates to composite components for electronic devices, such as frames, housings, bezels, or portions thereof for electronic devices. In some examples, a composite housing for an electronic device may include a preformed exterior or portion, also referred to as a case, hav...

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Abstract

The invention discloses a composite housing of an electronic device. The composite housing can include a metal shell including a first material having a first set of material properties and a surfaceat least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

Description

[0001] Cross References to Related Applications [0002] This patent application claims priority to U.S. Provisional Patent Application 62 / 798,343, filed January 29, 2019, entitled "CORE SHELLWITH VARIOUSFILLER MATERIALS FOR ENHANCED THERMALCONDUCTIVITY," the entire disclosure of which is hereby incorporated by reference Incorporated into this article. technical field [0003] The embodiments generally relate to electronic devices. More specifically, the present embodiment relates to housings for electronic equipment. Background technique [0004] Electronic devices are pervasive in society and can take many forms from watches to computers. Electronic devices, including portable electronic devices such as handheld phones, tablet computers, and watches, may come into contact with various surfaces during use. Additionally, the use, transport and storage of such equipment can place mechanical and thermal stress on the equipment. [0005] Components for these devices, such ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00H05K5/02H05K5/04
CPCH05K5/0217H05K5/04H05K5/0213H04M1/0202G06F1/1626G06F1/1656H04M1/0283A45C11/00A45C2011/002H05K5/0004G06F2200/1633H05K5/03
Inventor W·A·康特A·W·梅施克高磊A·米斯拉A·W·威廉姆斯H·李L·E·胡顿M·B·威滕伯格J·A·尤尔科
Owner APPLE INC