Carbon fiber oriented thermal interface material and preparation method thereof

A technology of thermal interface material and carbon fiber, which is applied in heat exchange materials, chemical instruments and methods, cooling/ventilation/heating transformation, etc., can solve the problems of difficult arrangement of thermal conductive fillers and high thermal conductivity, and achieve improved thermal conductivity and high thermal conductivity Coefficient, the effect of good application prospects

Inactive Publication Date: 2020-08-07
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For this reason, the present invention proposes a carbon fiber oriented thermal interface material and its preparation method. The preparation method is simple and solves the problem of difficult longitudinal arrangement

Method used

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  • Carbon fiber oriented thermal interface material and preparation method thereof
  • Carbon fiber oriented thermal interface material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] This embodiment provides a method for preparing a carbon fiber oriented thermal interface material, which includes the following steps:

[0024] (1) Premixing: Take 300g of carbon fiber, 500g of spherical alumina powder, 200g of vinyl silicone oil, 2g of hydrogen-containing silicone oil, 0.5g of platinum catalyst, and 0.5g of inhibitor ethynyl cyclohexanol into a vacuum mixer, and stir for 10 minutes to obtain raw materials mixture;

[0025] (2) Orientation: Pour the raw material mixture in step (1) into a mold for molding, place it horizontally for leveling, and then apply 100 Hz high-frequency vibration for 10 minutes in the vertical direction, that is, in the thickness direction parallel to the leveling, Start heating and curing at 120°C for 10 minutes, and then release the mold to obtain the carbon fiber oriented thermal interface material.

[0026] The carbon fiber oriented thermal interface material prepared in this example was subjected to scanning electron micr...

Embodiment 2

[0028] This embodiment provides a method for preparing a carbon fiber oriented thermal interface material, which includes the following steps:

[0029] (1) Premixing: Take 300g of carbon fiber, 500g of spherical alumina powder, 200g of vinyl silicone oil, 2g of hydrogen-containing silicone oil, 0.5g of platinum catalyst, and 0.5g of inhibitor ethynyl cyclohexanol into a vacuum mixer, and stir for 10 minutes to obtain raw materials mixture;

[0030] (2) Orientation: Pour the raw material mixture in step (1) into the mold used for molding, place it horizontally for leveling, and then apply 1KHz high-frequency vibration for 10 minutes in the vertical direction, that is, the thickness direction parallel to the leveling, Start heating and curing at 120°C for 10 minutes, and then release the mold to obtain the carbon fiber oriented thermal interface material.

Embodiment 3

[0032] This embodiment provides a method for preparing a carbon fiber oriented thermal interface material, which includes the following steps:

[0033] (1) Premixing: Take 300g of carbon fiber, 500g of spherical alumina powder, 200g of vinyl silicone oil, 2g of hydrogen-containing silicone oil, 0.5g of platinum catalyst, and 0.5g of inhibitor ethynyl cyclohexanol into a vacuum mixer, and stir for 10 minutes to obtain raw materials mixture;

[0034] (2) Orientation: Pour the raw material mixture in step (1) into the mold used for molding, place it horizontally for leveling, and then apply 20KHz high-frequency vibration for 10 minutes in the vertical direction, that is, the thickness direction parallel to the leveling, Start heating and curing at 120°C for 10 minutes, and then release the mold to obtain the carbon fiber oriented thermal interface material.

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PUM

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Abstract

The invention discloses a carbon fiber oriented thermal interface material and a preparation method thereof. The preparation method comprises the following steps: 1, taking the thermal interface material to be leveled, wherein raw materials of the thermal interface material comprise heat conduction filler, and the heat conduction filler comprises carbon fibers and spherical aluminum oxide; (2) applying vibration to the thermal interface material, wherein the vibration direction is parallel to the thickness direction of the leveled thermal interface material; and (3) curing the thermal interface material to obtain the carbon fiber oriented thermal interface material. According to the invention, the one-dimensional linear chopped carbon fibers are directionally arranged along the thickness direction of the thermal interface material in a vibration manner, the carbon fibers are directionally arranged along the vibration direction, so that the heat-conducting filler is directionally arranged in the material to form a longitudinal heat-conducting channel, the heat conductivity coefficient of the thermal interface material is further improved, and the thermal interface material has a relatively good application prospect in the aspect of heat dissipation of a CPU or other electronic elements.

Description

technical field [0001] The invention relates to the technical field of thermal interface materials, in particular to a carbon fiber oriented thermal interface material and a preparation method thereof. Background technique [0002] In recent years, with the continuous development of electronic components in the direction of miniaturization, integration, and high power, electronic components are advancing in the direction of integrating more functions and maximizing computing speed, and their power and calorific value are also further increasing. According to research, there are nearly a million transistors on a single integrated circuit today, and even the heat flux generated by computer chips exceeds the heat flux generated by the friction between intercontinental missiles and air, which can reach 300W / cm 2 Left and right, if the ultra-high heat flow energy is not dissipated in an effective way, it will cause serious heating of the integrated circuit. At present, the therm...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K7/06C08K7/18C09K5/14H05K7/20
CPCC08L83/04C08L2205/025C09K5/14H05K7/2039C08K7/06C08K7/18
Inventor 祝渊陈安琪迟克禹吴雁艳蒋文龙唐正阳
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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