A pcb press-fit laminated board structure

Abstract

The invention relates to a PCB laminated board structure, comprising a multi-layer PCB board body; the PCB board body has an insulating medium layer and a core board; the insulating medium layer and the core board are provided with via holes, and connected There is copper foil, the insulating medium layer is provided with a tank; the tank is provided with a metal heat dissipation core; the metal heat dissipation core is provided with a conduction hole; the inner wall of the via hole is copper-plated; The copper foil runs through the conduction hole; the semi-cured insulating medium is filled between the copper foil and the conduction hole; the heat conduction seat is arranged around the PCB body; the heat conduction seat is connected to the metal heat dissipation core . The invention greatly improves the heat dissipation efficiency of the PCB board by building a metal heat dissipation core in the insulating medium layer of the PCB board body, effectively controls the temperature of the PCB board during use, and improves the service life and reliability of the PCB board . The supporting locking mechanism can correspond to the PCB board, and it will not prevent the normal use of the PCB board while targeting the metal heat dissipation core.

Description

technical field [0001] The invention relates to a laminated board structure, in particular to a PCB laminated board structure, which belongs to the technical field of PCB board processing. Background technique [0002] As the PCB is rapidly moving toward high-density signal conductors, high-frequency signal transmission, and high-speed digitalization, it will bring greater conductive loss and dielectric loss, which will cause the inside of the PCB (dielectric layer) to heat up and heat up. Since the thermal conductivity of the traditional PCB dielectric layer is only about 0.24W / m·K, the conduction and heat dissipation performance is very poor, and the temperature rise of the conductive PCB dielectric layer increases sharply, making the working temperature of the PCB rise from ≤70°C to 100°C, or even Reaching 130°C, at such a high temperature, it will bring to PCB and components: (1) Various properties will change with temperature rise, such as different CTE values, which wi...

AI Technical Summary

Problems solved by technology

Since the thermal conductivity of the traditional PCB dielectric layer is only about 0.24W / m·K, the conduction and heat dissipation performance is very poor, and the temperature rise of the conductive PCB dielectric layer increases sharply, making the working temperature of the PCB rise from ≤70°C to 100°C, or even Reaching 130°C, at such a high temperature, it will bring to PCB and components: (1) Various properties will change with temperature rise, such as different CTE values, which will increase the size difference and lead to larger solder joints The interface "pulls" thermal stress, increases the conductive loss and dielectric loss inside the PCB, etc.; (2) The shape (state) will change, such as changing the PCB's overall size, bending, twisting, etc.

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