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Double-layer high-entropy alloy composite film and preparation method and application thereof

A composite film and high-entropy alloy technology, applied in the field of high-entropy alloys, can solve the problem that inorganic materials cannot meet high toughness, high hardness and high resistivity at the same time, and achieve strong bonding force, uniform film structure and simple preparation method Effect

Active Publication Date: 2020-08-25
JIANGSU UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the defect that the inorganic materials of the functional units of flexible electronic devices in the prior art cannot simultaneously satisfy high toughness, high hardness and high resistivity, the present invention provides a double-layer high-entropy alloy composite film and its preparation method and application , the prepared double-layer high-entropy alloy composite film has good bonding between layers, and the film surface is relatively flat and free of defects

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Examples

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Effect test

Embodiment 1

[0028] A double-layer high-entropy alloy composite film, the bottom layer of the composite film is a copper layer, and the surface layer is (CoCrFeMnNi)X y , The layer has a coherent structure, X is a non-metallic element N, and the atomic ratio of Co, Cr, Fe, Mn, Ni, and X is 1:1:1:1:0.3.

[0029] A method for preparing a double-layer high-entropy alloy composite film, using the double-target automatic co-sputtering technology installed in a radio frequency magnetron sputtering apparatus, after pre-sputtering the purity 99.99% CoCrFeMnNi and Cu targets, through the automatic co-sputtering technology Copper thin film is first deposited on the silicon substrate, and then (CoCrFeMnNi)X is deposited continuously on the surface of the copper thin film. y film, forming a double-layer high-entropy alloy composite film with longitudinal composition and mechanical properties changes. Specifically include the following steps:

[0030] (1) Substrate preparation: place the polished sil...

Embodiment 2

[0041] A double-layer high-entropy alloy composite film, the bottom layer of the composite film is a copper layer, and the surface layer is (CoCrFeMnNi)X y , There is a coherent structure between the layers, X is a non-metallic element N, and the atomic ratio of Co, Cr, Fe, Mn, Ni, and X is 1:1:1:1:0.5.

[0042] A method for preparing a double-layer high-entropy alloy composite film is basically the same as in Example 1, except that the flow rate of high-purity nitrogen gas is 8 sccm during the sputtering process of the CoCrFeMnNi target in step (5).

[0043] The characterization method of the composite film is the same as in Example 1, and the results show that the surface layer hardness of the composite film is 11 GPa, the bottom layer hardness is 2 GPa, and the resistivity is 410 μΩ·cm.

Embodiment 3

[0045] A double-layer high-entropy alloy composite film, the bottom layer of the composite film is a copper layer, and the surface layer is (CoCrFeMnNi)X y , The layer has a coherent structure, X is a non-metallic element N, and the atomic ratio of Co, Cr, Fe, Mn, Ni, and X is 1:1:1:1:0.1.

[0046] A method for preparing a double-layer high-entropy alloy composite film is basically the same as in Example 1, except that the flow rate of high-purity nitrogen gas is 11 sccm during the sputtering process of the CoCrFeMnNi target in step (5).

[0047] The characterization method of the composite film is the same as in Example 1, and the results show that the surface layer hardness of the composite film is 15 GPa, the bottom layer hardness is 2 GPa, and the resistivity is 908 μΩ·cm.

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Abstract

The invention belongs to the technical field of high-entropy alloys, and particularly relates to a double-layer high-entropy alloy composite film and a preparation method and application thereof. A copper layer is arranged on the bottom layer of the composite film, (CoCrFeMnNi)Xy is arranged on the surface layer, and a coherent structure is arranged between the bottom layer and the surface layer.X is a non-metallic element O or N, the atom ratio of Co to Cr to Fe to Mn to Ni to X is 1:1:1:1:y, and y=0.1-0.8. A preparation method of the double-layer high-entropy alloy composite film is furtherprovided. A copper film is firstly deposited on a Si substrate through an automatic co-sputtering technology, then a (CoCrFeMnNi)Xy film is continuously deposited on the surface of the copper film, and the double-layer high-entropy alloy composite film with variable longitudinal ingredients and mechanical properties is formed. The double-layer high-entropy alloy composite film and the substrate are combined well, the characteristics of being high in specific resistance, toughness and hardness are achieved, and the double-layer high-entropy alloy composite film has important application valueon a flexible micro electro mechanical system.

Description

technical field [0001] The invention belongs to the technical field of high-entropy alloys, and in particular relates to a double-layer high-entropy alloy composite film and its preparation method and application. Background technique [0002] The future development trend of medical devices is to be able to connect flexible electronic devices with monitored objects for physiological index information collection and monitoring, especially some ultra-thin, ultra-soft, and stretchable skin electronic devices need to be bonded comfortably with the human body for a long time. It is required to have good affinity with the human body, stretchable, bendable and other functions. Therefore, flexible electronic devices are the core technology supporting humanized medical equipment. Flexible electronic devices include circuits, sensors, electrodes, chips, resistors, etc. However, the inorganic materials used to prepare the functional units of flexible electronic devices have a certain ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/16C23C14/08C23C14/06C23C14/35A61B5/00
CPCC23C14/165C23C14/08C23C14/0641C23C14/35C23C14/0036A61B5/6801A61B2562/164Y02E30/10
Inventor 王泽宋永晶孙志娟汤嘉立谈文胜夏少华杨晓红叶霞李小平卢雅琳雷卫宁张扬
Owner JIANGSU UNIV OF TECH