A cooling method and system for ensuring the stability of network equipment

Abstract

The invention provides a cooling method and system for ensuring the stability of network equipment, belonging to the technical field of network equipment. The heat dissipation method of the present invention includes the following steps: establishing the temperature relationship between the CPU main control and the surrounding peripheral components, the wireless transceiver chip and the surrounding peripheral components; monitoring the temperature of each component of the network equipment in real time; According to the first set threshold value, the communication distance between the network device and the client is judged; according to the communication distance between the network device and the client, the corresponding cooling strategy is adopted until the temperature returns to below the first set threshold value. The beneficial effects of the invention are: no hardware cost is increased, the cost is low, and the treatment is done from the source, and the cooling effect is remarkable.

Description

A heat dissipation method and system for ensuring the stability of network equipment technical field The present invention relates to the technical field of network equipment, in particular to a method for cooling and ensuring the stability of network equipment. system. Background technique [0002] For dual-band routers, APs, signal amplifiers, MESH that support 802.11b / g / a / n / ac / ax network standards, even To the existence of two 5GHz tri-band routers and AP products of the same frequency, as well as network equipment such as CPE, when the equipment is fully loaded When working, or the working environment is in a high temperature environment, the main working components of the device are CPU, WIFI chip, amplifier, memory Larger heat and higher temperature will cause the temperature of the PCB motherboard to be too high. Surrounding components such as Flash, crystal oscillator clock, DC-DC power supply If the temperature of the device is too high, which exceeds the no...

AI Technical Summary

Problems solved by technology

[0002] For dual-band routers, APs, signal amplifiers, MESHs that support 802.11b / g / a / n / ac / ax network standards, and even two 5GHz tri-band routers and AP products with the same frequency, as well as network equipment such as CPE, When the equipment is working at full load, or the working environment is in a high temperature environment, the main working components of the equipment, CPU, WIFI chip, amplifier, and memory, generate heat and have a high temperature, which will cause the temperature of the PCB main board to be too high, and surrounding components such as: The temperature of Flash, crystal oscillator clock, DC-DC power supply and other components is too high, which exceeds the normal operating temperature of the above components. Working for a long time will cause the performance of the device to decline, and even cause the system to work abnormally, affecting the life of the device.

[0003] At present, the existing heat dissipation schemes include adding heat sinks, fans, using better and more expensive heat dissipation materials, enlarging the chassis, increasing the area of ​​the PCB board and other expensive traditional heat dissipation, and also reducing the emission duty cycle. Cooling treatment to reduce the power consumption of the whole machine, but the first solution above will lead to higher cost, the product is too large, affecting the appearance, and sometimes the cooling effect is not significant. The second solution, although it does not affect long-distance coverage, However, it will lead to shortcomings such as extreme performance degradation for users at close or intermediate distances. There are also solutions to obtain good heat dissipation by reducing the CPU frequency, but this will inevitably reduce the CPU processing capacity of the product, thereby reducing the performance of the product.

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