A water-cooled heat dissipation device for chip heat dissipation
A technology of water cooling and chip heat dissipation, applied in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of low heat dissipation efficiency and power consumption, and achieve high heat dissipation effect
Active Publication Date: 2020-11-20
山东永通汽车配件有限公司
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Problems solved by technology
[0002] For any chip to work, it must meet a temperature range. This temperature refers to the temperature on the silicon chip, usually called the junction temperature; traditional chip heat sinks generally dissipate heat by attaching heat-conducting metal sheets and fans, and there are generally The heat dissipation efficiency is relatively low, power consumption and other issues, so it is necessary to design a water-cooled heat dissipation device that can efficiently dissipate heat from the chip
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[0016] Combine below Figure 1-4 The present invention is described in detail, and for convenience of description, the orientations mentioned below are now stipulated as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.
[0017] refer to Figure 1-4 According to an embodiment of the present invention, a water-cooled heat dissipation device for chip heat dissipation includes a fuselage 10, a pulley chamber 14 is provided in the fuselage 10, and a fixed device is installed in the upper side wall of the pulley chamber 14. Control the motor 18, the lower side of the pulley cavity 14 is provided with a cooling chamber 29, the bottom wall of the lower side of the cooling cavity 29 is provided with a chip 31, and the lower side of the pulley cavity 14 is provided with a cooling cavity 29 for A fan cooling device 901 for chip cooling, the fan cooling device 901 includes a first rotating shaft 69 rotatably arran...
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The invention discloses a water-cooling heat dissipation device for chip heat dissipation, which includes a fuselage, a pulley cavity is arranged in the fuselage, a control motor is fixed in the upper side wall of the pulley cavity, and a control motor is fixed in the pulley cavity. The lower side is provided with a heat dissipation chamber, and a chip is provided on the bottom wall of the lower side of the heat dissipation chamber. The present invention is provided with a temperature-controlled compression pump, which can detect the temperature of the chip through a temperature-sensing package, and then transmit it through a capillary tube, thereby controlling the temperature of the liquid chamber. The flow rate of the cooling liquid inside is controlled according to the temperature; the present invention is equipped with a fan cooling device, which can accelerate the volatilization and flow of the cooling liquid through the second fan to atomize the cooling liquid on the cooling pipe, thereby making the heat dissipation of the chip more efficient; The invention is provided with a conversion device, which can liquefy the atomized cooling liquid, thereby facilitating the recovery and reuse of the cooling liquid.
Description
technical field [0001] The invention relates to the technical field related to chip heat dissipation, in particular to a water-cooled heat dissipation device for chip heat dissipation. Background technique [0002] For any chip to work, it must meet a temperature range. This temperature refers to the temperature on the silicon chip, usually called the junction temperature; traditional chip heat sinks generally dissipate heat by attaching heat-conducting metal sheets and fans, and there are generally The heat dissipation efficiency is relatively low, power consumption and other issues, so it is necessary to design a water-cooled heat dissipation device that can efficiently dissipate heat from the chip. Contents of the invention [0003] The object of the present invention is to provide a water-cooled heat dissipation device for chip heat dissipation, which is used to overcome the above-mentioned defects in the prior art. [0004] A water-cooling heat dissipation device for...
Claims
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IPC IPC(8): H01L23/367H01L23/427H01L23/433
CPCH01L23/367H01L23/427H01L23/433
Inventor 李梦霞
Owner 山东永通汽车配件有限公司