Flexible substrate and mechanical stripping method thereof
A flexible substrate and mechanical peeling technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of restricting the development of foldable products, the limitation of flexible substrate structure, and the inability to realize mass production of flexible substrates.
Pending Publication Date: 2020-09-01
TRULY SEMICON
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Problems solved by technology
[0005] The invention discloses a flexible substrate and its mechanical peeling method, which is used to solve the problem in the prior art that due to the limitation of the structure of the flexible substrate, the mass production of the flexible substrate cannot be realized, which seriously limits the development of related industries of foldable products.
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[0049] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0050] Such as figure 1 , figure 2As shown, the mechanical peeling method and device of the present invention are used to realize the peeling of the flexible substrate 1 . The flexible substrate 1 can be applied to display devices, touch devices, Micro-LED backplanes or solar cell devices and the like. The flexible substrate 1 can be two layers, namely the rig...
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The invention discloses a flexible substrate and a mechanical stripping method thereof. The flexible substrate comprises a rigid substrate and a flexible substrate, wherein the flexible substrate is adhered to the rigid substrate and comprises an effective area and a non-effective area surrounding the effective area, the effective area comprises a product arrangement area used for arranging flexible devices and an initial stripping edge located on one side of the product arrangement area, and a gasket used when the flexible substrate is stripped is placed between the initial stripping edge andthe rigid substrate. According to the scheme provided by the invention, the initial stripping edge of the flexible substrate can be firstly fixed on a roller, the flexible substrate is stripped through rotation of the roller, automatic control can be achieved in the stripping process of the flexible substrate, and the technical problems of device circuit breakage, function failure and the like caused by the fact that the stripping angle and the stripping speed cannot be controlled in the manual stripping process of the flexible substrate in a mechanical mode can be effectively solved.
Description
technical field [0001] The invention relates to the technical field of flexible device manufacturing, in particular to a flexible substrate and a mechanical stripping method thereof. Background technique [0002] With the rise of flexible substrates, various types of flexible electronic devices based on flexible substrates (such as flexible AM-OLED, flexible TFT-LCD, flexible touch devices, etc.) have entered the sunrise period and the embryonic period. Its vigorous development momentum will definitely detonate the consumer electronics market and lead high-end consumer electronics to a new era of flexible and foldable products. [0003] The current flexible electronic devices use different processes to produce various electronic devices on the flexible base material of the flexible substrate, and then adopt the laser lift-off (LLO: Laser Lift-Off) method to separate the flexible base material from the rigid substrate surface of the flexible substrate. Peel off without loss....
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IPC IPC(8): H01L27/12H01L21/78H01L21/67
CPCH01L21/67092H01L21/7813H01L27/12H01L27/1218
Inventor 李源谢雄才眭斌张文进杨亮
Owner TRULY SEMICON