Unlock instant, AI-driven research and patent intelligence for your innovation.
Method of manufacturing bonded body, temporary-fixing member, and stacked body
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A temporary fixation and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems of increased conductive resistance, position deviation, fixed state deviation, etc., and achieve the effect of suppressing position deviation
Pending Publication Date: 2020-09-01
FUJIFILM CORP
View PDF5 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
As mentioned above, the residue of the adhesive layer used for temporary fixing becomes the cause of the increase in the conductive resistance
[0010] In addition, when there is an adhesive layer during joining, the adhesive layer may flow depending on the joining conditions of the actual joining, and the position of the temporarily fixed state may deviate.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0491] In Example 1, after aligning the interposer, the anisotropic conductive member, and the TEG chip, between the interposer and the anisotropic conductive member, and between the anisotropic conductive member and the TEG chip, Isopropanol (boiling point 82°C) was arranged as a temporary fixing member, and after temporarily fixing it with isopropanol, removal and bonding of isopropanol were performed at the same time to produce a joined body. Furthermore, in Example 1, at the time of joining, the temporary fixing member was replaced with gas.
[0492] In Example 1, isopropanol was used as the temporary fixing member. After the temporary fixing was performed at a temperature of 50°C for 1 minute, the bonding was performed at a temperature of 270°C for 10 minutes. Therefore, the boiling point at the time of bonding was 82°C. The isopropanol is vaporized and removed.
Embodiment 2
[0494] In Example 2, compared with Example 1, the difference is that the removal process and joining process of the temporary fixing member are not performed at the same time, and the removal process of the temporary fixing member is a process of replacing the temporary fixing member with gas. Same as Example 1.
[0495] In Example 2, when the temporary fixing was performed, the temporary fixing was performed under the conditions of a temperature of 150°C for 1 minute, the isopropylalcohol was vaporized and removed, and then the bonding was performed.
Embodiment 3
[0497] In Example 3, compared with Example 1, the difference is that the removal process and the joining process of the temporary fixing member are not performed at the same time, and the removal process of the temporary fixing member is a vaporization process, and it is the same as Example 1 except that.
[0498] In Example 3, when the temporary fixing was performed, the temporary fixing was performed under the conditions of a temperature of 100°C for 1 minute, the isopropylalcohol was vaporized and removed, and then the filler was filled, and then the bonding was performed.
[0499] Regarding the filler, U8410-73CF3 (product number) manufactured by NAMICS CORPORATION was used, 10 g of filler was added to the dispenser, and a vacuum dispenser manufactured by Toray Engineering Co., Ltd. set at a pressure of 130 Pa and a temperature of 100°C ( Model: FS2500) has been dispensed.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Login to View More
Abstract
Provided are a method of manufacturing a bonded body in which positional error between electrically conductive members is suppressed and inhibition to bonding of the electrically conductive members issuppressed, a temporary-fixing member for use in the manufacture of the bonded body, and a stacked body. The method of manufacturing a bonded body comprises: a temporary-fixing step of providing a temporary-fixing member between at least two electrically conductive members having electrical conductivity to thereby temporarily fix the at least two electrically conductive members to each other; a removing step of removing the temporary-fixing member; and a bonding step of bonding the at least two electrically conductive members to each other. The temporary-fixing member is used for the method of manufacturing a bonded body. The stacked body comprises a stack in which a temporary-fixing member is provided between at least two electrically conductive members having electrical conductivity.
Description
Technical field [0001] The present invention relates to a method for manufacturing a bonded body in which at least two conductive members are joined as a connection object, a temporary fixing member for manufacturing the bonded body, and a laminate in which at least two conductive members are laminated, and in particular to a bonded body Manufacturing method, temporary fixing component and laminated body. Background technique [0002] A structure formed by filling a plurality of through holes provided on an insulating substrate with a conductive substance such as metal is one of the fields that have also attracted attention in nanotechnology in recent years. For example, it is expected to be an anisotropic conductive member. use. [0003] Anisotropic conductive components are inserted between electronic components such as semiconductor elements and the circuit board, and electrical connection between the electronic components and the circuit board can be obtained only by pressing,...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to View More 
Login to View More