Surface treatment method and application of ceramic burning bowl

Abstract

The invention discloses a surface treatment method and application of a ceramic burning bowl. The surface treatment method mainly comprises the following steps: cleaning and drying the ceramic burningbowl, coating the surface with slurry A, and then drying again, wherein the raw materials of the slurry A are BaCO3 and TiO2 powder, and the ratio of BaCO3 to TiO2 powder is (70-72): (30-28) wt%; andsintering the eramic burning bowl coated with the slurry A at 1280-1380 DEG C, and keeping the temperature for 2-4 hours to form a layer of enamel protective film on the surface of the ceramic burning bowl, wherein the layer of enamel protective film is capable of effectively preventing the fine powder of the ceramic burning bowl from falling off in the repeated use process, and further avoidingthe defect of pinholes formed in a semiconductor ceramic. The method is simple to operate, special equipment is not needed, and conventional semiconductor ceramic production equipment can be used.

Description

technical field [0001] The invention belongs to the technical field of electronic ceramics, relates to a firing process in the production process of semiconductor ceramics, in particular to a surface treatment method and application of a ceramic firing pot. Background technique [0002] As we all know, the semiconductor ceramics of the barium titanate system are the basic materials for the manufacture of high specific capacitance surface layer capacitors and grain boundary layer capacitors. Blanks are stacked with dozens of templates and then placed in a firing pot for firing at a temperature of 1280-1360°C. The firing bowl is generally processed by refractory manufacturers with high-purity alumina. In order to prevent the chemical reaction between alumina and the product green body at high temperature, the usual practice is to place a high-purity zirconia backing plate inside the firing bowl. Block the direct contact between the firing bowl and the product green body. How...

AI Technical Summary

Problems solved by technology

Conventional methods and measures can only prevent the bottom of the green body from being in direct contact with the firing pot, and cannot prevent the fine powder from the upper firing pot from falling on the product green body and chemically reacting with the green body

The chemical reaction between the fine powder of the sintered bowl and the green body of the product at high temperature will leave holes as thin as needle points on the product, which are called pinhole defects in industrial production, and the defects will make the dielectric layer of semiconductor ceramic capacitors change. Thin, resulting in poor voltage resistance of the capacitor or short-circuit breakdown