Wafer spin coating waste liquid collecting device
A technology of spin coating and waste liquid collection, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve the deformation and damage of wafers, the shaking and offset of spin coating, and the effect of waste liquid collection that affects coating uniformity and other issues to achieve the effect of preventing pressure damage to the wafer and ensuring stability
Pending Publication Date: 2020-09-18
芯米(厦门)半导体设备有限公司
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Problems solved by technology
[0005] In order to overcome the deficiencies of the existing technologies, a waste liquid collection device for wafer spin coating is proposed, which solves the problem that the structure of the waste liquid collection device Simple, they are all embedded and placed for waste liquid collection, which is prone to swaying and offset during spin coating, and when pressing with excessive force, it is easy to cause deformation and damage to the wafer, affecting the uniformity of coating and the effect of waste liquid collection
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[0027] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0028] see figure 1 , the present invention provides a wafer spin coating waste liquid collection device: including a top plate 1 , a collection box 2 , an auxiliary pressing device 3 , a placement seat 4 , a placement slot 5 and an air duct 6 . The middle part of the bottom of the top plate 1 is tightly fixed with the collection box 2, and the middle part of the top of the top plate 1 is fixedly equipped with a placement seat 4, and the middle part of the top of the placement seat 4 is embedded with a placement groove 5, which is convenient for auxiliary placement. The auxiliary pressing device 3...
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The invention discloses a wafer spin coating waste liquid collecting device. The device structurally comprises a top plate, a collecting box, auxiliary pressing devices, a placing seat, a placing groove and an air duct; the auxiliary pressing devices are arranged at the left end and the right end of the top of the top plate respectively, so that a knob can drive a rotating disc to rotate; the front end of the rotating disc is clamped and slides with a transverse groove in a connecting plate through a clamping column; the rear end of the rotating disc and an arc-shaped groove in a pressing piece slide in a clamped mode through a shifting piece, the pressing piece fixedly slides through a limiting piece, and therefore the pressing piece telescopically slides along a sliding groove in a mounting plate. Thus, a wafer is adjusted, pressed and fixed, and the stability of waste liquid collection is guaranteed. Meanwhile, a vertical groove penetrates through the middle in the lower end of thepressing piece, the inner diameter surface of the vertical groove and the limiting piece slide in a clamped mode, normal sliding is facilitated, and the sliding stability is guaranteed.
Description
technical field [0001] The invention relates to the technical field of wafer spin coating, in particular to a wafer spin coating waste liquid collection device. Background technique [0002] New technologies and markets have continuously increased the production capacity requirements of equipment. Under the same floor area, more process modules must be configured to achieve more production capacity. The integration of process modules continues to increase. A new spin coating module of a spin coating unit, so a waste liquid collection device is required for waste liquid collection during processing. [0003] When it is necessary to use the waste liquid collection device for wafer spin coating, because the structure of the existing waste liquid collection device is relatively simple, they are all embedded and placed for waste liquid collection, which is prone to spin coating shaking and offset, and excessive force Re-pressing and tightening may easily cause wafer deformation ...
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IPC IPC(8): H01L21/67
CPCH01L21/67005H01L21/67011H01L21/6715
Inventor 许志雄
Owner 芯米(厦门)半导体设备有限公司