Power package module and electronic device

Abstract

The invention provides a power packaging module and an electronic device. The power packaging module comprises a to-be-plastic-packaged structure, a plurality of power pins, a plurality of auxiliary pins and an injection molding body with at least one insertion stopping protrusion. According to the technical scheme of the invention, through the insertion stopping projection directly formed on theinjection molding body through injection molding, the problem of excessive insertion of the auxiliary pin into the PCB can be prevented when the auxiliary pin is inserted into the PCB, so that the auxiliary pin can be well matched with the PCB; the auxiliary pins can be inserted into the PCB in a straight pin form, so that a bending forming mold and a bending forming process do not need to be added so as to substantially reduce the product cost; and the insertion stopping protrusion can be arranged between the auxiliary pins with high-low voltage difference, so that the creepage distance between the high-low voltage auxiliary pins is greatly increased, the safety is enhanced, and the system application from low voltage to medium-high voltage is satisfied.

Description

technical field [0001] The invention relates to the technical field of power module design, in particular to a power package module and an electronic device. Background technique [0002] With the vigorous development of electric vehicles, as the core component of the main drive motor, the power module not only needs to meet the high power output of electric vehicles, but also needs to have the characteristics of compact size and light weight, so as to facilitate the actual installation in the application, reduce the The overall volume and weight of electronic control components. In order to increase power density, reduce voltage overshoot, and allow internal chips to have a higher rated output current, this requires the power module to have a better design structure, so as to obtain the characteristics of low thermal resistance and low stray inductance. [0003] The existing power modules in the form of double-sided heat dissipation package generally have the following def...

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Problems solved by technology

[0004] 1. The functional pins extend from the injection molding body of the power module and are exposed to the air. In normal operation, some pins will bear high voltage. Therefore, they need to meet the safety of creepage distance and electrical clearance at the same time. Requirements, generally speaking, the design value of the creepage distance is usually greater than the design value of the electrical clearance, however, increasing the creepage distance between the pins may increase the size of the package, thereby increasing the product cost

[0005] 2. Usually, a part of the auxiliary pins will be bent and assembled with the PCB board. The bent pins can play a role in preventing insertion and prevent the auxiliary pins from being over-inserted on the PCB. However, this method will As a result, PCB installation is difficult, and it is necessary to add a bending forming process mold to bend the pins, which increases the cost of the product and the difficulty of process realization

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