Circuit board and its soldering process, circuit board assembly
A technology for circuit boards and electronic devices, used in circuit thermal components, printed circuit components, electrical connection printed components, etc. Uniform and guaranteed effect of reflow soldering process
Active Publication Date: 2022-02-22
北京优必选智能机器人有限公司
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Problems solved by technology
[0004] One of the purposes of the embodiments of the present application is to provide a circuit board, which aims to solve the technical problems in the prior art that the through holes on the circuit board lead to virtual soldering and soldering deviation of electronic devices
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[0032] Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are intended to explain the present application, and should not be construed as limiting the present application.
[0033] In the description of the present application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, rather than Nothing to indicate or imply that a referenced device or ...
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This application is applicable to the field of heat dissipation technology, and provides a circuit board and its welding process, and a circuit board assembly, including a dielectric board and a pad on the dielectric board. A heat dissipation through hole is opened on the pad, and the heat dissipation through hole penetrates the dielectric board. and the pad, the inner peripheral wall of the heat dissipation through hole is laid with a first heat conduction layer, the heat dissipation through hole is filled with an insulator, and the first heat conduction layer is pressed against the outer peripheral wall of the insulator. By setting the heat dissipation through hole that runs through the dielectric board and the pad at the same time, the inner peripheral wall of the heat dissipation through hole is laid with a first heat conduction layer, and the inside of the heat dissipation through hole is filled with an insulator. When the electronic device is soldered on the pad, the insulator can block The solder flows into the heat dissipation through hole, avoiding the uneven distribution of the solder during soldering, and ensuring the reflow soldering process of the electronic device; in addition, the heat generated during the soldering of the electronic device and the pad can be conducted to the dielectric board through the first heat conduction layer. One side of the pad, so that the effective heat dissipation of the pad and electronic devices can be realized during reflow soldering.
Description
technical field [0001] This application belongs to the technical field of heat dissipation, and more specifically relates to a circuit board, its welding process, and a circuit board assembly. Background technique [0002] Electronic devices are generally soldered to circuit boards by reflow soldering. The temperature of electronic devices and circuit boards will rise sharply during soldering, which will affect their performance. Therefore, through holes are usually opened on the circuit board to realize the circuit board and electronic heat dissipation of the device. [0003] The solder used in the soldering of electronic devices and circuit boards forms a liquid state under high temperature conditions, and easily flows into the through holes, resulting in uneven distribution of solder, resulting in virtual soldering and welding deviation of electronic devices, affecting electronic devices and circuits. plate weld strength. Contents of the invention [0004] One of the ...
Claims
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IPC IPC(8): H05K1/02H05K1/11H05K3/40
CPCH05K1/0204H05K1/116H05K3/40H05K2201/06H05K2203/04
Inventor 赵波熊友军
Owner 北京优必选智能机器人有限公司