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PDN circuit and Internet of Things module

A circuit and electrical connection technology, applied in the direction of printed circuit components, printed circuits connected with non-printed electrical components, and electrical connection of printed components, etc., can solve problems such as poor PDN performance, and achieve the effect of improving performance and avoiding crashes.

Active Publication Date: 2020-09-22
重庆芯讯通无线科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0026] The technical problem to be solved by the present invention is to provide a PDN circuit and an Internet of Things module in order to overcome the poor performance of the PDN in the prior art.

Method used

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  • PDN circuit and Internet of Things module
  • PDN circuit and Internet of Things module
  • PDN circuit and Internet of Things module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] This embodiment provides a PDN circuit. refer to figure 1 , 2 , the PDN circuit includes a single-sided fabric PCB 11; the single-sided fabric PCB includes n board layers arranged in sequence. The surface of the single-sided cloth PCB is provided with a filter capacitor 13 , a decoupling capacitor 14 , a PMU 12 , and an external device connection unit 2 ; the external device connection unit includes a first power terminal 201 and a first ground terminal 202 .

[0059] The second layer L2 of the single-sided cloth PCB includes the first wiring area 15; the third board layer L3 of the single-sided cloth PCB includes the second wiring area 16 and the third wiring area 17; the single-sided cloth PCB The fourth board layer L4 includes the fourth wiring area 18; the fifth board layer L5 of the single-sided cloth PCB includes the fifth wiring area 19; the sixth board layer L6 of the single-sided cloth PCB includes the sixth wiring area 20 The first wiring area is electrical...

Embodiment 2

[0080] This embodiment provides an Internet of Things module. refer to Figure 5, the Internet of Things module The Internet of Things module includes a processor 5 and the PDN circuit of Embodiment 1. The processor 5 is electrically connected to the external device connection unit, the power supply terminal 501 of the processor is electrically connected to the first power supply terminal, and the ground terminal 502 of the processor is electrically connected to the first ground terminal.

[0081] As an optional implementation manner, the processor 5 is a BGA packaged processor. In another optional implementation manner, the processor 5 is a QFN packaged processor. Optionally, the processor 5 is an SDM600 processor.

[0082] In view of the fact that the PDN circuit improves the PDN performance and can effectively avoid problems such as crashes, power failures, and repeated restarts during the operation of the processor, the Internet of Things module in this embodiment has h...

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Abstract

The invention discloses a PDN circuit and an Internet of Things module. The PDN circuit comprises a single-sided cloth PCB; the single-sided cloth PCB comprises n board layers which are arranged in sequence; a filter capacitor, a decoupling capacitor, a PMU and an external device connecting unit are arranged on the surface of the cloth of the single-sided cloth PCB; the external device connectingunit comprises a first power supply end and a first grounding end; a first wiring area is electrically connected with the power supply end of the PMU, the positive electrode of the filter capacitor and a sixth wiring area respectively; a fourth wiring area is electrically connected with the sixth wiring area, the positive electrode of the decoupling capacitor and the first power supply end; a second wiring area is electrically connected with the grounding end of the PMU, the negative electrode of the filter capacitor and a fifth wiring area. A third wiring area is electrically connected with the fifth wiring area, the negative electrode of the decoupling capacitor and the first grounding end. According to the invention, the PDN performance is improved, and the problems of crash, power failure, repeated restart and the like in the operation process of the Internet of Things module can be effectively avoided.

Description

technical field [0001] The invention belongs to the technical field of PDN (power distribution network), and in particular relates to a PDN circuit and an Internet of Things module. Background technique [0002] At present, many IoT modules with high-speed processors on the market require secondary placement, and they are generally packaged in BGA (Ball Grid Array) or QFN (Quad Flat No-lead) , so only the PCB (printed circuit board) design of single-sided cloth devices can be used. However, the power supply pins (pins) of many high-speed processors in the industry are mainly allocated in the middle of the processor IC (integrated circuit). The industry generally adopts double-sided cloth devices to solve the high-performance requirements of processors for PDNs. It is a big technical problem in the industry to achieve single-sided fabric devices and meet the requirements of high-speed processors for PDN performance. [0003] Take the SDM660 (a processor) high-speed process...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/18
CPCH05K1/11H05K1/18
Inventor 王亚玲
Owner 重庆芯讯通无线科技有限公司