Method and device for dividing substrate
A technology for substrates and disconnecting lines is applied in the field of substrate disconnection and substrate disconnection devices, which can solve the problems of complex structure of substrate disconnection devices, easy generation of fragments in the subsection of substrates, large setting area, etc. Excellent precision
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no. 1 approach
[0045] (1) Marking device
[0046] use figure 1 The scribing device 1 will be described. figure 1 It is a brief perspective view of the scribing device. The scribing apparatus 1 is an apparatus for performing scribing processing on a brittle material substrate W (hereinafter referred to as “substrate W”). The substrate W is, for example, a glass substrate, a ceramic substrate, a sapphire substrate, a silicon substrate, or the like.
[0047] The scribing apparatus 1 includes a table 2 on which a substrate W is placed. The table 2 is placed on the movable table 3 , and the movable table 3 can move along horizontal guide rails 5 a and 5 b and is driven by a ball screw 7 rotated by a motor 6 .
[0048] It should be pointed out that in the following description, the horizontal direction in which the guide rails 5a and 5b extend is referred to as the Y direction, and the horizontal direction perpendicular thereto is referred to as the X direction.
[0049] The table 2 is provid...
no. 2 approach
[0104] In the first embodiment, one embodiment has been described using a single substrate, but the type of the substrate is not particularly limited. For example, the present invention can also be applied to the case of separately dividing and bonding each substrate W in a mother substrate (a pair of substrates W bonded to each other).
[0105] use Figure 9 , as such an example, the second embodiment will be described. Figure 9 is a schematic cross-sectional view of the substrate of the second embodiment. It should be noted that the basic configuration is the same as that of the first embodiment, so the following description will focus on different points.
[0106] The bonded substrate Ws is formed by bonding the first substrate W1 formed with the first scribe line S1 and the second substrate W2 formed with the second scribe line S2 .
[0107] The breaking device has a first breaking lever 44A and a second breaking lever 44B arranged up and down.
[0108] (1) Scribing l...
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