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Double-sided copper-clad circuit board

A double-sided copper clad, circuit board technology, applied in the direction of circuit heating devices, circuit heating components, printed circuit components, etc., can solve the problems of poor heat dissipation, low precision of circuit processing, difficulty in large-scale application, etc.

Pending Publication Date: 2020-10-23
方炜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the heat dissipation of LED printed circuit boards mainly uses metal substrates or ceramic substrates. The metal substrate and copper foil are laminated with insulating resin, which has poor heat dissipation and cannot meet the requirements of LED products; while ceramic substrates are expensive and are in the market. It is difficult to popularize and apply in a large area; and the above two substrates are not suitable for the manufacture of double-sided or multi-layer circuit boards, and the circuit processing accuracy is low

Method used

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  • Double-sided copper-clad circuit board
  • Double-sided copper-clad circuit board
  • Double-sided copper-clad circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] see Figure 1-2 As shown, Embodiment 1 of the present invention provides a double-sided copper-clad circuit board, including a heat dissipation support plate 1, a first copper-clad laminate 2 and a second copper-clad laminate disposed on the upper side and the lower side of the heat dissipation support plate 1 respectively 3. The first copper foil 4 arranged on the upper side of the first copper clad laminate 2 and the second copper foil 5 arranged on the lower side of the second copper clad laminate 3, the first copper clad laminate 2, the second copper clad laminate 3 and A conductive hole 6 runs through the heat dissipation support layer, and the conductive hole 6 is used as a conductive channel between the first copper foil 4 and the second copper foil 5 , and a copper layer is disposed in the conductive hole 6 . Wherein, the first copper-clad laminate 2 and the second copper-clad laminate 3 are made of glass fiber cloth layer or fiber cloth layer or non-woven fabri...

Embodiment 2

[0035] see Figure 3-4 As shown, Embodiment 2 of the present invention discloses a copper-clad circuit board on top. The difference between it and Embodiment 1 lies in the structure of the metal support plate. In Embodiment 2, a heat dissipation silicon grease 8 is provided in the middle of the metal support Inside the hollow cavity 14.

[0036] Preferably, the metal support plate includes a stacked upper plate portion 12 and a lower plate portion 13, the lower end of the upper plate portion 12 is provided with an upper square groove, the upper end of the lower plate portion 13 is provided with a lower square groove, and the upper end of the lower plate portion 13 is provided with a lower square groove. The combination of the groove and the lower square groove forms the cavity 14 . An injection port 15 communicating with the cavity and used for injecting heat-dissipating silicon grease into the cavity 14 is provided on the upper plate portion 12 / lower plate portion 13 , and ...

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Abstract

The invention discloses a double-sided copper-clad circuit board. The double-sided copper-clad circuit board comprises a heat dissipation supporting plate, a first copper-clad plate and a second copper-clad plate which are arranged on the upper side face and the lower side face of the heat dissipation supporting plate respectively, a first copper foil arranged on the upper side face of the first copper-clad plate, and a second copper foil arranged on the lower side face of the second copper-clad plate. A conductive hole penetrates through the first copper-clad plate, the second copper-clad plate and the heat dissipation supporting layer plate and serves as a conductive channel between the first copper foil and the second copper foil, and a copper layer is arranged in the conductive hole. According to the double-sided copper-clad circuit board provided by the invention, on one hand, the heat dissipation effect of the double-sided copper-clad circuit board can be improved through the heat dissipation support plate, and on the other hand, the problem of low circuit processing precision caused by only taking a metal substrate or a ceramic substrate as a substrate can be avoided throughthe combination of the heat dissipation support plate and the copper-clad plate, so that the processing precision is high.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a double-sided copper-clad circuit board. Background technique [0002] With the rapid development of microelectronics integration technology and highly integrated circuit boards, it is necessary to improve the heat dissipation and high-voltage resistance of circuit boards to ensure their service life and accuracy. [0003] At present, the heat dissipation of LED printed circuit boards mainly uses metal substrates or ceramic substrates. The metal substrate and copper foil are laminated with insulating resin, which has poor heat dissipation and cannot meet the requirements of LED products; while ceramic substrates are expensive and are in the market. It is difficult to popularize and apply in a large area; and the above two substrates are not suitable for manufacturing double-sided or multi-layer circuit boards, and the circuit processing accuracy is low. Contents of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0201H05K2201/06
Inventor 方炜
Owner 方炜