Wafer batch conveying mechanism
A transfer mechanism and wafer technology, applied in the direction of conveyor objects, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of low wafer transfer efficiency and low degree of automation
Active Publication Date: 2020-10-27
BEIJING JINGYI AUTOMATION EQUIP CO LTD
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Problems solved by technology
[0002] In the semiconductor industry, processes such as cleaning require batch processing of wafers, which requires equipment that can batch out and transfer wafers. However, the existing mechanisms for wafer out and transfer are automated To a lesser extent, resulting in lower wafer transfer efficiency
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[0038] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0039] Embodiments of the present invention provide a batch transfer mechanism for wafers, such as figure 1 As shown, the wafer batch transfer mechanism 100 includes a machine base 1 , a wafer unloading device 2 and a wafer handling device 3 .
[0040] Such as figure 1 As shown, the base 1 is provided with a first placement position for placing ...
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The embodiment of the invention provides a wafer batch conveying mechanism, which comprises a machine base, a wafer box discharging device and a wafer carrying device, and the machine base is providedwith a first placing position for placing a wafer box and a second placing position for placing a wafer; the wafer box discharging device is arranged on the machine base corresponding to the first placing position, and the wafer box discharging device is used for taking out the wafer from the wafer box; and the wafer carrying device is arranged on the machine base corresponding to the wafer box discharging device, and the wafer carrying device is used for carrying the wafers taken out by the wafer box discharging device to the second placing position. According to the wafer batch conveying mechanism provided by the embodiment of the invention, the wafers can be taken out of the wafer boxes in batches through the wafer box discharging device, and the wafers can be conveyed in batches through the wafer carrying device, so that the conveying efficiency of the wafers is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductor auxiliary equipment, in particular to a wafer batch transfer mechanism. Background technique [0002] In the semiconductor industry, processes such as cleaning require batch processing of wafers, which requires equipment that can batch out and transfer wafers. However, the existing mechanisms for wafer out and transfer are automated The degree is low, resulting in low wafer transfer efficiency. Contents of the invention [0003] An embodiment of the present invention provides a wafer batch transfer mechanism, aiming to design a mechanism capable of batch-out and transfer of wafers, so as to improve the efficiency of wafer transfer. [0004] An embodiment of the present invention provides a batch transfer mechanism for wafers, including: [0005] A base, the base is provided with a first placement position for placing the wafer cassette and a second placement position for placing the wafe...
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IPC IPC(8): H01L21/677
CPCH01L21/67766H01L21/67781
Inventor 刘洪亮郝瀚梁烁
Owner BEIJING JINGYI AUTOMATION EQUIP CO LTD