Bonding pad processing device and pad maintenance method
A technology for processing devices and pads, applied in the direction of electrical connection formation of printed components, etc., can solve the problems of low reliability of BGA chips, difficulty in ensuring smooth structure, chip BGA pads falling off or damaged, etc.
Inactive Publication Date: 2020-10-27
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Problems solved by technology
[0002] Pad is the basic unit of PCBA (printed circuit board) surface mount assembly, used to form the pad pattern of the circuit board; now BGA package (Ball Grid Array solder ball array package) is widely used in chip design, with high The advantage of high density and high performance, but it brings with it the difficulty of maintenance. During the maintenance process or chip function damage, it is easy to cause the BGA pad on the PCBA board to fall off or be damaged.
[0003] At present, the usual maintenance method is that the engineer manually rotates the copper wire on the damaged pad to replace the pad. The copper wire is very thin and time-consuming to operate, and the structure is difficult to ensure smoothness. The general repair method has a low yield. High, so that the scrap rate of PCBA boards is extremely high, and it will cause low reliability of BGA chips after repair
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[0025] The core of the present invention is to provide a pad processing device, which can process pads with uniform specifications and improve the yield and reliability of pad maintenance.
[0026] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the pad processing device and pad maintenance method of the present invention will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0027] Such as figure 1 As shown, it is a structural diagram of a specific embodiment of the pad processing device provided by the present invention; the pad processing device includes a plate-shaped substrate 1, which generally extends laterally, and at least the bottom surface of the substrate 1 is plane, which can be aligned with the processing snug contact.
[0028] The pad hole 2 is opened through the substrate 1, and the thickness of the substrate 1 is greater than or e...
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The invention discloses a bonding pad processing device. A bonding pad hole is formed in a flat-plate-shaped substrate in a penetrating mode; the thickness of the substrate is greater than or equal tothat of a bonding pad; the shape and the size of the bonding pad hole are equal to those of the bonding pad; and the bonding pad hole can be filled with soldering paste to manufacture the bonding padwith the thickness less than or equal to that of the substrate. The bonding pad with the consistent size specification can be machined by adopting the device, and the yield and the reliability can beimproved compared with a traditional copper wire maintenance mode. The invention further provides a bonding pad maintenance method, which comprises the steps of placing the substrate on a machining plane, filling the bonding pad hole formed in the substrate with soldering paste, placing an enameled wire, and enabling one end of the enameled wire to be in contact with the soldering paste; heatingthe soldering paste after the enameled wire is placed in place, enabling the soldering paste to be melt and fixed with the enameled wire into an integrated bonding pad; and transferring the bonding pad to a PCBA board and fixing. Compared with a traditional copper wire winding mode, the method has the advantage that the yield and the reliability can be improved.
Description
technical field [0001] The invention relates to the technical field of electronic equipment maintenance, and further relates to a pad processing device. In addition, the present invention also relates to a pad repair method. Background technique [0002] Pad is the basic unit of PCBA (printed circuit board) surface mount assembly, used to form the pad pattern of the circuit board; now BGA package (Ball Grid Array solder ball array package) is widely used in chip design, with high The advantage of high density and high performance, but it brings with it the difficulty of maintenance. During the maintenance process or chip function damage, it is easy to cause the BGA pad on the PCBA board to fall off or be damaged. [0003] At present, the usual maintenance method is that the engineer manually rotates the copper wire on the damaged pad to replace the pad. The copper wire is very thin and time-consuming to operate, and the structure is difficult to ensure smoothness. The gener...
Claims
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IPC IPC(8): H05K3/42
CPCH05K3/42
Inventor 闫勇
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD