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Intermediary and electronic components including the intermediary

An electronic component, intermediary technology, applied in the field of interposers and electronic components including the interposer, capable of solving problems such as sheet distortion, defects during surface mounting operations, electrode pattern formation, etc.

Active Publication Date: 2022-06-21
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the case of an electronic component using an interposer in the related art, electrode patterns formed on the interposer body may not be formed as designed, causing a problem of generation of defects during surface mount operations.
[0010] For example, in surface mounting operations for disposing an interposer on a multilayer capacitor, phenomena such as chip tombstone defect (interposer tilted to one side due to a defective electrode pattern) or chip twist ( Part of the interposer protrudes to the outside of the multilayer capacitor) defect

Method used

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  • Intermediary and electronic components including the intermediary
  • Intermediary and electronic components including the intermediary
  • Intermediary and electronic components including the intermediary

Examples

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Embodiment Construction

[0047] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0048] This disclosure may, however, be exemplified in many different forms and should not be construed as limited to the specific embodiments set forth herein.

[0049] Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0050] In the drawings, the shapes and sizes of elements may be exaggerated for clarity. In addition, in the drawings, elements having the same function within the scope of the same inventive concept will be denoted by the same reference numerals.

[0051] Furthermore, throughout the drawings, the same reference numerals are used for parts having similar functions and operations.

[0052] Throughout the specification, unless specifically stated otherwise, when a component is referred to as "compr...

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Abstract

The present invention provides an interposer and an electronic assembly comprising the interposer, the interposer comprising: an interposer main body; a first lower pattern and a second lower pattern spaced apart from each other on the lower surface of the interposer main body; And the first upper pattern and the second upper pattern are spaced apart from each other on the upper surface of the interposer body. The first upper pattern includes a first shape ensuring layer and a first noise reduction layer arranged on the first shape ensuring layer, and the second upper pattern includes a second shape ensuring layer and a first noise reducing layer arranged on the second shape ensuring layer. A second noise reducing layer on a shape ensuring layer, the first shape ensuring layer and the second shape ensuring layer are spaced apart from each other on the upper surface of the interposer body. An electronic component includes a capacitor and the interposer.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0048884 filed in the Korean Intellectual Property Office on April 26, 2019, the disclosure of which is incorporated herein by reference in its entirety. technical field [0002] The present disclosure relates to an intermediary and an electronic assembly including the intermediary. Background technique [0003] Multilayer capacitors have a small size, can achieve high capacitance and are used as elements in various electronic devices. [0004] Such a multilayer capacitor has a structure in which a plurality of internal electrodes having different polarities are alternately arranged between dielectric layers. [0005] In this case, since the dielectric layer has piezoelectricity and electrostriction, when DC or AC is applied to the multilayer capacitor, a piezoelectric phenomenon occurs between the inner electrodes, which may cause periodic vibration, while The volume of the cap...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/30H01G4/005H01G4/06H01G4/232
CPCH01G4/30H01G4/012H01G4/35H01G4/12H01G2/065H01G4/005H01G4/228H01G4/232H01G4/40H05K2201/2045H05K2201/10378H05K2201/10015H05K1/141H05K3/3442H05K1/181H05K2201/049
Inventor 裵秀林李锺泌金海仁吴银珠
Owner SAMSUNG ELECTRO MECHANICS CO LTD