A laser device for wafer marking
A technology of laser equipment and wafers, which is applied in the laser field, can solve the problems of laser beam deviation, inability to set marks on chips, etc., and achieve the effect of correction
Active Publication Date: 2022-05-06
江苏亚威艾欧斯激光科技有限公司
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
In the prior art, lasers are usually used to mark chips, but after some lasers have been used for a long time, the laser beam emitted by the laser will deviate, making it impossible to set the mark on the desired position of the chip
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Embodiment Construction
[0032] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.
[0033] It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual impleme...
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Abstract
The present invention proposes a laser device for wafer marking, including: a laser, used to emit a laser beam; a beam expander, used to expand and collimate the laser beam; a beam adjustment unit, used to adjust the The direction of the laser beam; the mirror, used to change the direction of the laser beam; the focusing lens, used to focus the laser beam so that the laser beam is emitted vertically; wherein, the laser, the beam expander The mirror, the beam adjustment unit and the reflective mirror are sequentially arranged in a first direction, the reflective mirror, the focusing lens and the stage are sequentially arranged in a second direction, and the first direction is perpendicular to the The second direction; wherein, one end of the carrier is provided with a collector, and the other end of the carrier is provided with a drive unit, and the drive unit drives the carrier to perform linear motion to move the collector to within the calibration area. The laser equipment used for wafer marking proposed by the invention has long service life and high work efficiency.
Description
technical field [0001] The invention relates to the field of laser technology, in particular to a laser device for wafer marking. Background technique [0002] In the manufacturing process of a semiconductor device, the surface of a roughly disc-shaped wafer substrate is divided into a plurality of regions by dividing predetermined lines called void channels arranged in a mesh, and by forming ICs, Devices such as LSI constitute a semiconductor chip. The semiconductor devices constituted in this way are formed into individual devices by cutting along the blank channels. [0003] Thousands or tens of thousands of chips are distributed on a semiconductor wafer. In order to distinguish these chips according to production batches, letters or symbols need to be set on the surface of each chip to mark each chip. In the prior art, lasers are usually used to mark chips, but after some lasers are used for a long time, the laser beams emitted by the lasers will deviate, making it imp...
Claims
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IPC IPC(8): B23K26/042B23K26/70B23K26/064
CPCB23K26/042B23K26/702B23K26/064B23K26/0643
Inventor 凌步军朱鹏程袁明峰吕金鹏赵有伟滕宇孙月飞冷志斌冯高俊
Owner 江苏亚威艾欧斯激光科技有限公司