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A copper-clad layer structure of a single-layer printed circuit board

A single-layer printing, copper-clad technology

Active Publication Date: 2022-07-26
DONGGUAN HAOSHUN PRECISION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to address the deficiencies in the prior art. The application provides a copper-clad layer structure of a single-layer printed circuit board. The copper-clad layer structure can solve the problem of low adhesion

Method used

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  • A copper-clad layer structure of a single-layer printed circuit board
  • A copper-clad layer structure of a single-layer printed circuit board
  • A copper-clad layer structure of a single-layer printed circuit board

Examples

Experimental program
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Effect test

Embodiment 1

[0025] One of the specific embodiments of the copper-clad layer structure of a single-layer printed circuit board of the present invention is described by taking the printed circuit board mounting lens 5 as an example. Figure 2 to Figure 4 As shown, the copper clad layer structure includes a solder resist layer 4 , a copper clad layer 3 , an insulating layer 2 and a substrate 1 which are arranged in sequence from top to bottom. The copper clad layer 3 is provided with mounting holes for mounting components, and the solder resist layer 4 is provided with through holes corresponding to the mounting holes.

[0026] As an improvement, the bottom of the mounting hole is provided with a plurality of recesses 6 , and the plurality of recesses 6 are arranged on the top surface of the insulating layer 2 at intervals. In this embodiment, the horizontal cross-section of the hollow portion 6 is arranged in a triangular shape, a plurality of hollow portions 6 are arranged in a circular ar...

Embodiment 2

[0031] The second specific embodiment of the copper-clad layer structure of a single-layer printed circuit board of the present application, see Figure 5 In the horizontal cross-sectional view of the hollow portion 6 shown, the main technical solution of this embodiment is the same as that of Embodiment 1, and the features not explained in this embodiment are explained in Embodiment 1, and will not be repeated here. The difference between this embodiment and Embodiment 1 is that the horizontal section of the hollow part 6 is arranged in a long strip, which is easier to process, and the inflow rate of epoxy resin glue is faster, which improves the production efficiency.

Embodiment 3

[0033] The third specific embodiment of the copper-clad layer structure of a single-layer printed circuit board of the present application, see Image 6 In the horizontal cross-sectional view of the hollow portion 6 shown, the main technical solution of this embodiment is the same as that of Embodiment 1, and the features not explained in this embodiment are explained in Embodiment 1, and will not be repeated here. The difference between this embodiment and Embodiment 1 is that the horizontal section of the hollow part 6 is set in a wave shape, which can slow down the inflow rate of epoxy resin glue, and the wave structure can generate flocculation during the inflow of epoxy resin, which can ensure the epoxy resin The resin flows into the centers of the plurality of recesses 6 to further improve the adhesive force.

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PUM

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Abstract

The invention relates to the technical field of printed circuit boards, in particular to a copper-clad layer structure of a single-layer printed circuit board, comprising a copper-clad layer, an insulating layer and a substrate arranged in sequence from top to bottom, and the copper-clad layer is provided with holes for mounting components The bottom of the installation hole is provided with a plurality of hollow parts, and the plurality of hollow parts are arranged on the top surface of the insulating layer at intervals; the problem of small bonding force in the past is solved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a copper-clad layer structure of a single-layer printed circuit board. Background technique [0002] The direct type backlight strip is composed of printed circuit board (PCB board), light emitting diode (LED), lens, connector and other main components. The printed circuit board and the lens are mainly bonded by epoxy glue. However, the surface roughness of the PCB affects the adhesion between the PCB and the lens. [0003] see figure 1 , figure 1 It is a schematic structural diagram of the connection between the traditional printed circuit board and the lens 5. The lens 5 is provided with a foot portion located on the bottom end surface thereof. And substrate 1, which is an aluminum base layer. The solder resist layer 4 is also called a white oil layer. Before assembling the lens 5, it is necessary to remove the solder resist layer 4 and the copper clad layer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K3/30F21V17/10F21V23/00F21Y115/10
CPCH05K1/184H05K3/306F21V23/004F21V17/101F21Y2115/10
Inventor 郝建广陈志标牛威冯帅杰叶永康
Owner DONGGUAN HAOSHUN PRECISION TECH CO LTD