Cold plate

Abstract

The invention discloses a cold plate, which comprises a shell used for installing a plurality of devices to be cooled, and a liquid inlet and a liquid outlet are formed in the shell; wherein a first flow guide component and a second flow guide component are located in the shell, and at least one part of a preheating channel is defined by the first flow guide component; at least one part of a backflow channel is defined by the second flow guide component; the preheating channel is communicated with the liquid inlet; the backflow channel is communicated with the liquid outlet; at least one partof the preheating channel is adjacent to the backflow channel, and the first flow guide component and / or the second flow guide component located between the adjacent preheating channel and backflow channel can transfer heat. At least one part of the preheating channel is adjacent to the backflow channel, part of the second flow guide component between the adjacent preheating channel and backflow channel conducts heat transfer, the influence of the inlet effect on the device to be cooled is reduced, and therefore the temperature uniformity of the cold plate is improved.

Description

technical field [0001] The invention relates to the technical field of electronic heat dissipation, in particular to a cold plate. Background technique [0002] The power board is a structure in which hundreds of chips are arranged in parallel and in series on a PCB board, because the chip power supply voltage, computing power and chip temperature are strongly related. In order to improve the heat dissipation capability of the power board, a cold plate is usually set for heat dissipation. [0003] When the existing cold plate is applied to a multi-chip scenario, due to the influence of low fluid temperature and inlet effect (large heat transfer coefficient), the temperature of the chip at the inlet is generally much lower than that at other locations. The performance of the power board is that the temperature distribution is obvious, and the overall temperature uniformity is poor, which cannot meet the requirements of multi-chip temperature uniformity and small temperature ...

AI Technical Summary

Problems solved by technology

[0003] When the existing cold plate is applied to a multi-chip scenario, due to the influence of low fluid temperature and inlet effect (large heat transfer coefficient), the temperature of the chip at the inlet is generally much lower than that at other locations. The performance on the force plate is that the temperature distribution is obvious, and the overall temperature uniformity is poor, which cannot meet the requirements of multi-chip temperature uniformity and small temperature difference.

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