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3D printing method and system for ceramic moldless direct writing

A 3D printing and ceramic technology, applied in the field of 3D printing, can solve single problems and achieve the effect of ensuring continuity, avoiding collision, and avoiding model collapse

Active Publication Date: 2021-05-07
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the process of realizing the present application, the inventor found the following technical problems in the prior art: the ceramic dieless direct writing molding has the following restrictions: the ceramic material is continuously extruded, that is, the printing path is a strict single continuous path, there is no stop; the model is support-free, that is, no external supports are required; there is no collision between the print head and the model during the entire printing process; there is sufficient overlap between layers

Method used

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  • 3D printing method and system for ceramic moldless direct writing
  • 3D printing method and system for ceramic moldless direct writing
  • 3D printing method and system for ceramic moldless direct writing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] This embodiment provides a 3D printing method for ceramic moldless direct writing;

[0051] The 3D printing method of ceramic moldless direct writing, including:

[0052] S101: Generate an initial swept surface based on the input first contour curve, second contour curve, trajectory curve and set center point;

[0053] S102: Map the initial swept surface to the actual printing coordinate system to obtain a swept surface model;

[0054] S103: For the swept surface model, calculate the reciprocating printing path of ceramic moldless direct writing;

[0055] S104: For the swept surface model, calculate the extrusion amount of the ceramic slurry for ceramic moldless direct writing;

[0056] S105: Complete the 3D printing of the ceramic moldless direct writing of the swept surface model.

[0057] As one or more embodiments, before the step S101, it also includes:

[0058] S100: Obtain the input first contour curve, second contour curve, trajectory curve and set center po...

Embodiment 2

[0144] This embodiment provides a 3D printing system for ceramic moldless direct writing;

[0145] 3D printing system for ceramic moldless direct writing, including:

[0146] a generation module configured to: generate an initial swept surface based on the input first contour curve, second contour curve, trajectory curve and set center point;

[0147] The mapping module is configured to: map the initial swept surface to the actual printing coordinate system to obtain the swept surface model;

[0148] The printing path calculation module is configured to: calculate the reciprocating printing path of ceramic moldless direct writing for the swept surface model;

[0149] The extrusion amount calculation module is configured to: calculate the extrusion amount of the ceramic slurry of the ceramic moldless direct writing for the swept surface model;

[0150] The printing module is configured to: complete the 3D printing of the ceramic moldless direct writing of the swept surface mo...

Embodiment 3

[0155] This embodiment also provides an electronic device, including: one or more processors, one or more memories, and one or more computer programs; wherein, the processor is connected to the memory, and the one or more computer programs are programmed Stored in the memory, when the electronic device is running, the processor executes one or more computer programs stored in the memory, so that the electronic device executes the method described in Embodiment 1 above.

[0156] It should be understood that in this embodiment, the processor can be a central processing unit CPU, and the processor can also be other general-purpose processors, digital signal processors DSP, application specific integrated circuits ASIC, off-the-shelf programmable gate array FPGA or other programmable logic devices , discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor, or the processor may be any conventional processor, o...

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Abstract

This application discloses a 3D printing method and system for ceramic moldless direct writing, including: generating an initial sweep surface based on the input first contour curve, second contour curve, trajectory curve and set center point; , mapped to the actual printing coordinate system to obtain the swept surface model; for the swept surface model, calculate the reciprocating printing path of the ceramic direct writing; for the swept surface model, calculate the extrusion of the ceramic slurry for the ceramic direct writing Output; Complete the 3D printing of the ceramic moldless direct writing of the swept surface model.

Description

technical field [0001] The present application relates to the technical field of 3D printing, in particular to a 3D printing method and system for ceramic moldless direct writing. Background technique [0002] The statements in this section merely mention the background art related to this application, and do not necessarily constitute the prior art. [0003] Ceramic materials are widely used in the fields of chemical industry, machinery, electronics, aerospace and biomedical engineering, and are indispensable materials for the development and application of modern high-end technologies. Ceramic materials have the characteristics of high wear resistance, high mechanical strength, good thermal stability and chemical stability. However, the extremely high hardness and brittleness of ceramic parts make it extremely difficult to process, not only the cutting tools will suffer severe wear, but also cracks and other defects will occur in ceramic parts during processing, which mak...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/00B28B1/00B33Y10/00B33Y30/00B33Y50/00
CPCB28B1/001B33Y10/00B33Y30/00B33Y50/02
Inventor 吕琳刘文强周宇钟凡超闫鑫
Owner SHANDONG UNIV