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Laser surface mount packaging device with light beam shaping function

A packaging device and beam shaping technology, which is applied to lasers, laser components, semiconductor lasers, etc., can solve the problems of limited use of beam shaping device systems, and achieve the effect of simple structure

Inactive Publication Date: 2020-11-13
SHANDONG NOVOSHINE OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the defects in the prior art, the embodiment of the present invention provides a laser surface-mount packaging device with beam shaping to solve the problem of limited use of the beam shaping device system.

Method used

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  • Laser surface mount packaging device with light beam shaping function
  • Laser surface mount packaging device with light beam shaping function
  • Laser surface mount packaging device with light beam shaping function

Examples

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Embodiment Construction

[0030] Embodiments of the technical solutions of the present invention will be described in detail below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, and therefore are only examples, and cannot be used to limit the protection scope of the present invention.

[0031] For illustrative purposes, Figure 4 The double-dot dash line in the middle is the refraction line of the light, the direction indicated by the arrow on the double-dot dash line is the refraction direction of the refraction line, and the solid line and the arrow are the reflection direction of the light beam.

[0032] Such as Figure 2 to Figure 4 Commonly shown, a laser surface-mount packaging device with beam shaping, including an insulating base 1, the insulating base 1 is provided with a laser 2 (side-emitting laser), and the insulating base 1 located downstream of the laser 2 is provided with Th...

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Abstract

The invention discloses a laser surface mount packaging device with a light beam shaping function, which comprises an insulating base, a laser is arranged on the insulating base, a light spot shaper is arranged on the insulating base positioned at the downstream of the laser, and a reflector is arranged on the insulating base positioned at the downstream of the light spot shaper; and an N-pole electrifying structure and a P-pole electrifying structure are arranged between the insulating base and the laser. In the use process, the laser is powered on through the N-pole electrifying structure and the P-pole electrifying structure, and light generated by the laser is shaped through the light spot shaper and then reflected out through the reflector. By the adoption of the device, SMD packagingof all components is achieved, and compared with a traditional TO packaging mode and the like, the device is small in size, small in occupied space and wide in application scene; and meanwhile, shaping of various required morphologies can be carried out on light spots and light beams.

Description

technical field [0001] The invention belongs to the technical field of optoelectronic integrated packaging, in particular to a laser surface mount packaging device with beam shaping. Background technique [0002] At present, laser output methods are divided into vertical cavity surface emission and edge emission. Although the beam of the edge emission laser 7 is more concentrated than the vertical cavity surface, it is still necessary to perform beam shaping according to the application during packaging. figure 1 It is a schematic diagram of the divergence of the edge-emitting laser beam (including the light-emitting surface 701 and the diverging beam surface 702). The size of the spot is proportional to the distance from the light-emitting surface. The farther away from the light-emitting surface, the larger the beam, and the larger the optical device used to shape the beam , leading to the difficulty of miniaturization of the entire system. The commonly used packaging meth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/00H01S5/022H01S5/024G02B27/09
CPCG02B27/09H01S5/0071H01S5/022H01S5/024
Inventor 邓群雄覃志伟席庆男
Owner SHANDONG NOVOSHINE OPTOELECTRONICS CO LTD