PCB micro-channel heat dissipation embedded structure

Abstract

The invention relates to a PCB micro-channel heat dissipation embedded structure. The PCB micro-channel heat dissipation embedded structure comprises a chip, filler, solder balls, a PCB and a micro-channel radiator. A chip is arranged above the PCB, a micro-channel radiator is arranged between the lower surface of the chip and the upper surface of the PCB, filler is arranged on the outer side of the micro-channel radiator, solder balls are arranged in the filler, the upper surface of the micro-channel radiator is connected with the lower surface of the chip, and the lower surface of the micro-channel radiator is connected with the upper surface of the PCB. The outer wall surface of the micro-channel radiator is connected with the inner wall surface of the filler; the micro-channel radiatorcomprises a silicon wafer, a cover plate and a heat dissipation film, a channel groove is formed in the silicon wafer, a groove opening of the channel groove is covered by the cover plate or the cover plate and the silicon wafer to form a micro-channel, and the heat dissipation film is fixed to the silicon wafer and / or the cover plate. The LED lamp has the advantages of being good in heat dissipation capacity, simple in structure, easy to manufacture and the like.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a PCB board micro-channel heat dissipation embedded structure. Background technique [0002] Microwave and millimeter wave radio frequency integrated circuit technology is the foundation of modern national defense weaponry and Internet industry. Millimeter-wave radio frequency integrated circuits also have huge actual needs and potential markets. [0003] However, for high-frequency microsystems, the area of ​​the antenna array is getting smaller and smaller, and the distance between the antennas must be kept within a certain range so that the entire module can have excellent communication capabilities. However, for analog device chips such as radio frequency chips, the area cannot be reduced exponentially like digital chips. In this way, there will be no enough area for ultra-high frequency radio frequency microsystems to place PA / LNA at the same time. LNAs ...

AI Technical Summary

Problems solved by technology

This liquid cooling process has poor heat dissipation effect due to too many layers of heat transfer between the heat-generating chip and the heat-dissipating fluid.

In recent years, the micro-channel heat dissipation system that directly acts on the bottom of the chip has been widely studied. The micro-channel can be directly welded to the bottom of the chip, and each chip has a separate liquid supply system, which can realize chips in different positions and different areas. The function of the same heat dissipation capacity, but the existing micro-channels are generally made of metal or silicon materials, and the heat transfer capacity is limited, especially when the heat is transferred to the bottom of the fins, it is easily affected by the heat dissipation material of the micro-channels

Images