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Circuit board, manufacturing method thereof and electronic equipment

A manufacturing method and technology of electronic equipment, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit components, etc., can solve the problem of easy bulging and foaming of ink on circuit boards, and achieve the effect of eliminating foaming and improving adhesion

Active Publication Date: 2020-11-20
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Based on the clearance requirement of the antenna, the area where the antenna is installed on the circuit board generally does not have metal lines or metal holes except for the antenna coil. Since there are not too many vias or other lines in the clearance area, the ink on the circuit board is easy to bulge and bubble.

Method used

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  • Circuit board, manufacturing method thereof and electronic equipment
  • Circuit board, manufacturing method thereof and electronic equipment
  • Circuit board, manufacturing method thereof and electronic equipment

Examples

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Embodiment Construction

[0025] The application will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present application, but not to limit the scope of the present application. Likewise, the following embodiments are only some of the embodiments of the present application but not all of them, and all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.

[0026] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understoo...

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PUM

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Abstract

The embodiment of the invention provides a circuit board. The circuit board comprises a base material and a first ink layer; the base material comprises a first surface and a second surface; a plurality of through holes are formed in the base material; a patterned metal layer is formed on the first surface; the first ink layer is formed on the first surface and covers the plurality of through holes and at least part of the patterned metal layer; at least part of the space in each through hole is filled with the first ink layer. According to the circuit board provided by the embodiment of the invention, the patterned metal layer and the first ink layer are formed on the base material; the through holes are formed; the first ink layer covers at least part of the spaces of the through holes,so that the through holes can provide certain grabbing stress for the first ink layer; and therefore, the adhesive force of the first ink layer is improved, and ink bumps and bubbles formed on the first surface of the circuit board are reduced or eliminated.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a circuit board, a manufacturing method thereof, and electronic equipment. Background technique [0002] There are many ways to form the antenna, one of which is to design the copper pattern on the circuit board. First, the circuit board is used to make a coil on the circuit board to realize the antenna function. Based on the clearance requirement of the antenna, the area where the antenna is installed on the circuit board generally does not have metal lines or metal holes except for the antenna coil. Since there are not too many vias or other lines in the clearance area, the ink on the circuit board is easy to bulge and bubble. . Contents of the invention [0003] An embodiment of the present application provides a circuit board on the one hand, the circuit board includes a substrate and a first ink layer, the substrate includes a first surface and a s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/28
CPCH05K1/02H05K3/285
Inventor 刘幕俊
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD