Crystal bar cutting device and crystal bar cutting method
A technology for cutting devices and ingots, which is applied in the direction of fine working devices, working accessories, glass production, etc., can solve the problems of cutting line vibration and uneven silicon wafer surface, and achieve the effect of avoiding uneven cutting surface
Active Publication Date: 2020-11-24
XIAN ESWIN MATERIAL TECH CO LTD +1
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Problems solved by technology
[0004] In view of this, the present invention provides a crystal rod cutting device and a crystal rod cutting method, which can solve the problem in the prior art that the cutting line vibrates due to the spraying of mortar onto the cutting line, which in turn leads to the uneven surface of the cut silicon wafer
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[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.
[0027] The inventor analyzed the existing wire cutting process and found that when the mortar with a certain momentum is sprayed onto the cutting wire, it will impact the cutting wire and cause it to vibrate. The distance from the mortar nozzles on the left and right sides of the wheel to the ingot is relatively large. In this case, the impact of the mortar on the ingot and the cutting line...
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The invention provides a crystal bar cutting device and a crystal bar cutting method. The crystal bar cutting device comprises a feeding table and a mortar supply unit, wherein the feeding table is used for fixing a to-be-cut crystal bar and driving the to-be-cut crystal bar to move along a feeding direction, mortar outlets of the mortar supply unit are located in the two sides of the feeding table, and the mortar supply unit is used for spraying mortar to the surface of the to-be-cut crystal bar. According to the crystal bar cutting device, mortar for linear cutting can be directly sprayed tothe surface of the crystal bar instead of a cutting line, so that the situation that the cutting line is impacted and vibrates due to the fact that the mortar with a certain impulse is directly sprayed to the cutting line is avoided, and then the situation that the cutting surface is uneven due to the vibrating cutting line is avoided.
Description
technical field [0001] The invention relates to the technical field of silicon wafer preparation, in particular to a crystal rod cutting device and a crystal rod cutting method. Background technique [0002] At present, in the wire cutting process of ingots, the supplied mortar is usually sprayed onto the cutting line at a certain pressure, and then the ingot is cut by the cutting line with the mortar. On the one hand, the mortar can lubricate and clean the cutting debris. On the other hand, it can take away the heat generated by cutting. [0003] The quality of the wire cutting process determines the flatness of the surface of the cut silicon wafer. If the surface of the silicon wafer is uneven, additional trimming steps are required to correct the warped silicon wafer, which undoubtedly greatly increases the cost of the silicon wafer. Costs such as time and expense for preparation. Contents of the invention [0004] In view of this, the present invention provides a cry...
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Login to View More IPC IPC(8): B28D5/04B28D7/00
CPCB28D5/045B28D5/007Y02P40/57
Inventor 姜镕
Owner XIAN ESWIN MATERIAL TECH CO LTD