Microwave source air inlet device and semiconductor process equipment
A technology of air intake device and microwave source, which is applied to electrical components, discharge tubes, circuits, etc., can solve the problem of inconsistent flow of branch pipelines, reduce gas flow instability, improve flow consistency, and reduce flow resistance differences Effect
Pending Publication Date: 2020-11-24
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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[0007] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a microwave source air intake device and semiconductor process equipment to solve the problem of inconsistency in flow rates in different branch pipelines in the prior art
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[0030] In order to enable those skilled in the art to better understand the technical solution of the present invention, the microwave source air intake device provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0031] figure 2 The structure diagram of the semiconductor process equipment provided by the embodiment of the present invention. like figure 2 As shown, in the semiconductor process equipment, a microwave source intake device is provided, including a pipeline assembly and a plurality of flow control structures 3, wherein the pipeline assembly includes a main pipeline 1 and a plurality of branch pipelines 2. A plurality of branch pipelines 2 are respectively connected to the main pipeline 1, and a plurality of flow control structures 3 are arranged on the multiple branch pipelines 2 in one-to-one correspondence to increase the flow rate of each branch pipeline 2. Flow resistance, so that the flow of eac...
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The invention provides a microwave source air inlet device and semiconductor processing equipment. The device comprises a pipeline assembly and a plurality of flow control structures, the pipeline assembly comprises a main pipeline and a plurality of branch pipelines, the branch pipelines are connected with the main pipeline, and the flow control structures are arranged on the branch pipelines ina one-to-one correspondence mode and used for increasing the flow resistance of the branch pipelines so that the flow of the branch pipelines can be consistent. The multiple flow control structures are arranged, and the flow resistance of each branch pipeline is increased at the same time, so that the flow resistance difference caused by the difference between the branch pipelines is reduced to the maximum extent, and the flow consistency of the branch pipelines is improved.
Description
technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to a microwave source air intake device and semiconductor process equipment. Background technique [0002] Bump technology is currently the most important technical means in the packaging process, and the adhesive removal equipment in bump technology is used to remove residual adhesive, usually using a combination of microwave and bias to make the ionized O 2 React with the photoresist to achieve the purpose of removing the glue, in which, the O 2 Through the microwave source, and then start the light, so that O 2 Ionization. [0003] In order to increase production capacity and reduce costs, most of the degumming equipment currently adopts a double-chamber structure, that is, two film chambers perform degumming at the same time. Each chip cavity has its own set of microwave sources, but the factory only provides one O 2 , in order to make all the...
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IPC IPC(8): H01J37/32
CPCH01J37/32192H01J37/32449
Inventor 袁志涛韩炜
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD