Machining method of indium pipe
A kind of machining and lathe processing technology, applied in the field of indium tube machining, can solve the problems of time-consuming, labor-intensive, difficult to clean, and failure to meet the requirements of sputtering targets.
Inactive Publication Date: 2020-12-01
苏州思菲科新材料科技有限公司
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Problems solved by technology
During the turning process of such metals, chips are easily bonded to the workpiece, which is difficult to clean, and the surface becomes uneven, which cannot meet the requirements for sputtering targets.
Repeated grinding and cleaning is required, which is time-consuming and laborious, and the production efficiency is low
Method used
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[0019] Specific embodiments of the present invention will be further described in detail below.
[0020] Such as figure 1 and figure 2 As shown, the present invention provides a machining method of an indium tube, the purpose of which is to make the surface roughness of the indium tube below Ra1.5 μm and the size tolerance within 0.1 mm through lathe processing. The indium tube is a cylindrical structure, which includes a cylindrical or round tube-shaped liner and an indium material layer arranged outside the liner. The indium material layer is pure metal indium or an indium-tin alloy with a tin content of 0-50wt%. .
[0021] The present invention comprises the following steps:
[0022] 1) Clamp the indium tube to the machine tool;
[0023] 2) Clamp the special turning tool on the turning tool holder, and the angle between the turning tool and the indium tube is 40°;
[0024] 3) Turning starts along the axial direction of the indium tube, the processing amount per pass i...
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Abstract
The invention discloses a machining method of an indium pipe. Through the machining method, the surface roughness of the indium pipe machined through a lathe is Ra1.5 microns or below, the dimensionaltolerance is within 0.1 mm, and the indium pipe is of a cylindrical structure. The method comprises the following steps: 1) clamping the indium pipe on a machine tool; 2) clamping a specially-made turning tool on a turning tool rest, wherein the angle between the turning tool and the indium pipe is 30-45 degrees; 3) turning is started in the axial direction of the indium pipe, the pass machiningamount ranges from 0.5 mm to 4 mm, and the feeding speed ranges from 0.02 mm / r to 0.08 mm / r; and 4) collecting and removing linear turning scraps in time in the turning process, and preventing the linear turning scraps from being wound on the indium pipe. According to the indium pipe machined through the method, the dimensional tolerance can be controlled within 0.1 mm, the surface roughness is Ra1.6 microns or below, and the problems that in the indium pipe machining process, scraps adhere to a workpiece, the surface is rough, and materials are polluted and wasted can be effectively solved.
Description
technical field [0001] The invention belongs to the field of machinery, and in particular relates to a machining method for an indium tube. Background technique [0002] Indium targets are currently mainly used in the light-absorbing layer of CIGS thin-film solar cells, and non-metallic conductive films coated on the surface of mobile phone backplanes. The roughness of the target surface has a great influence on the sputtering process, and the rough surface of the target becomes the main cause of abnormal discharge during the sputtering process. It is found through research that the roughness of the target surface is controlled below Ra1.6μm, which can well suppress the generation of abnormal discharge. [0003] Pure metal indium or indium-tin alloy with a tin content of 0~50wt% is very soft and has strong adhesion. During the turning process of such metals, chips are easily bonded to the workpiece, which is difficult to clean, and the surface becomes uneven, which cannot ...
Claims
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IPC IPC(8): B23B1/00
CPCB23B1/00
Inventor 曹兴民
Owner 苏州思菲科新材料科技有限公司