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Chip assembly, heat dissipation circuit device and mobile terminal

A circuit device and chip technology, applied in circuits, electrical components, electric solid devices, etc., can solve the problem of difficult heat dissipation of chips, and achieve the effect of maintaining temperature rise, maintaining stable performance, and avoiding penetration

Active Publication Date: 2020-12-25
浙江集迈科微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a chip component, a heat dissipation circuit device and a mobile terminal for the problem of difficult heat dissipation of stacked chips.

Method used

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  • Chip assembly, heat dissipation circuit device and mobile terminal
  • Chip assembly, heat dissipation circuit device and mobile terminal
  • Chip assembly, heat dissipation circuit device and mobile terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as figure 1 and figure 2 As shown, the heat sink 10 includes more than two heat sinks 10 distributed at intervals on the surface of the chip 30 , and the micro-channels 11 of adjacent heat sinks 10 are relatively independent. Two or more heat sinks 10 are provided to form independent micro-flow channels 11, which can correspondingly reduce the temperature of a designated area of ​​the chip 30, and the cooling area is highly controllable. Optionally, the extending directions of two adjacent heat sinks 10 are parallel to each other. Optionally, three or more heat sinks 10 are equidistant to maintain the heat dissipation balance of the chip 30 ; or, three or more heat sinks 10 are distributed non-equidistantly to expand the heat dissipation range of the chip 30 .

Embodiment 2

[0038] Such as image 3 and Figure 4 As shown, on the basis of Embodiment 1, the chip assembly further includes a connecting piece 40 connecting two adjacent heat sinks 10 in sequence, and the connecting piece 40 is provided with a connecting channel 41, and the connecting channel 41 communicates with Adjacent to the micro-channels 11 of the heat sink 10 . The connecting member 40 is used to connect the micro-channels 11 of two adjacent heat sinks 10 to form a continuously curved micro-channel 11 structure and expand the range of liquid circulation. Optionally, the first diversion hole 12 and the second diversion hole 13 are set as one and connected to the continuous micro-channel 11 structure, so as to reduce the input interface and output interface of liquid. Optionally, the heat dissipation element 10 and the communication element 40 are integrally formed, and the communication element 40 is a curved connection part of the heat dissipation element 10 . Wherein, the conn...

Embodiment 3

[0040] Such as Figure 5As shown, on the basis of the first embodiment, the chip assembly further includes a first flow member 50 connected to one end of the heat sink 10 and a second flow member 60 connected to the other end of the heat sink 10, the The first confluence part 50 includes a first confluence channel 52 communicated with the micro-flow channel 11 and a first confluence hole 51 connected to the first confluence channel 52, and the second confluence part 60 includes The second confluence channel 62 connected to the channel 11 and the second confluence hole 61 connected to the second confluence channel 62 . Two or more heat sinks 10 are respectively connected to the first confluence channel 52 and the second confluence channel 62, the first confluence hole 51 communicates with the third diversion hole 21 correspondingly, and the second confluence hole 61 communicates with the fourth guide hole 22 correspondingly.

[0041] The first confluence member 50 serves as a...

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PUM

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Abstract

The invention relates to a chip assembly, a heat dissipation circuit device and a mobile terminal. The chip assembly comprises a chip; a heat dissipation piece which is fixedly connected to the surface of the chip and comprises at least one micro-channel for liquid to flow, and a first flow guide hole and a second flow guide hole which are correspondingly communicated with the micro-channel; and aprinted circuit board which comprises at least one mounting groove formed by recessing from the surface, and a third flow guide hole and a fourth flow guide hole which penetrate through the printed circuit board, are distributed at intervals and are communicated with the at least one mounting groove. The chip is connected to the printed circuit board, the heat dissipation piece is located in themounting groove, the first flow guide hole is correspondingly communicated with the third flow guide hole, and the second flow guide hole is correspondingly communicated with the fourth flow guide hole.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to chip components, heat dissipation circuit devices and mobile terminals. Background technique [0002] Technology Microwave and millimeter wave radio frequency integrated circuit technology is the foundation of modern national defense weaponry and Internet industry. There is also a huge actual demand and potential market for microwave and millimeter wave radio frequency integrated circuits. [0003] For high-frequency microsystems, the area of ​​the antenna array is getting smaller and smaller, and the distance between the antennas must be kept within a certain range so that the entire module can have excellent communication capabilities. However, the area of ​​analog device chips based on RF chips cannot achieve the same multiplier reduction effect as digital chips through technology, resulting in the ultra-high frequency RF microsystems unable to provide sufficient area ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373H01L21/50
CPCH01L23/367H01L23/373H01L21/50
Inventor 冯光建黄雷高群
Owner 浙江集迈科微电子有限公司