Powerful cushion pad of die
A buffer pad and mold technology, applied in the field of stamping dies, can solve the problems of large damage to the buffer pad and high production batches of stamping dies, and achieve the effects of ensuring the force bearing effect, simplifying maintenance and reducing noise.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0030] as attached figure 1 to attach Figure 8 Shown:
[0031] The present invention provides a mold strong buffer pad, including a nitrogen spring 1, a sleeve 3 and a rubber buffer pad 5; The base 6 is fixedly installed in the bottom mold; the top of the sleeve 3 is located at the top of the lower mold, and the bottom of the sleeve 3 is inserted inside the lower mold; the inside of the sleeve 3 is hollow, and the bottom of the sleeve 3 is slidably connected to the inside of the lower mold, and supports The column 2 is slidably connected to the inside of the sleeve 3. When the support column 2 on the top of the nitrogen spring 1 moves up and down to buffer and protect the upper mold, the sleeve 3 can limit the position of the support column 2 to prevent the support column 2 from moving up and down. The offset affects the effect of the force on the top of the support column 2 and the upper mold; the rubber buffer pad 5 is a ring structure, and the rubber buffer pad 5 is conn...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


