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Fixing mechanism for digital-to-analog conversion chip production

A fixing mechanism and digital-to-analog conversion technology, applied in the direction of workpiece clamping devices, manufacturing tools, etc., can solve problems such as offset, lower chip efficiency, and unstable fixation, and achieve the effects of preventing offset, reasonable structure, and simple operation

Inactive Publication Date: 2021-01-19
HENGYANG TRANSISTOR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a fixing mechanism for the production of digital-analog conversion chips to solve the existing fixing mechanism for the production of digital-analog conversion chips proposed in the above-mentioned background technology. When switching chips, there will be problems of unstable fixation and offset, which greatly reduces the efficiency of chip production.

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  • Fixing mechanism for digital-to-analog conversion chip production
  • Fixing mechanism for digital-to-analog conversion chip production
  • Fixing mechanism for digital-to-analog conversion chip production

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] see Figure 1-4 , the present invention provides a technical solution: a fixing mechanism for digital-to-analog conversion chip production, including a device base 1, the top of the device base 1 is fixedly connected with a first fixing plate 2, a first sliding rod 4, The protective shell 3 is fixedly connected with the second slide bar 5 on the left side of the inner wall bottom of the protective shell 3, and the outer upper end of the first slide bar ...

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Abstract

The invention discloses a fixing mechanism for digital-to-analog conversion chip production, and relates to the technical field of digital-to-analog conversion chip fixing mechanisms. The fixing mechanism for digital-to-analog conversion chip production comprises a device base, a first fixing plate, a first sliding rod and a protective shell are fixedly connected to the top end of the device basein sequence from left to right, a second sliding rod is fixedly connected to the left side of the bottom of the inner wall of the protective shell, and a transmission sliding block is slidably connected to the upper end of the outer side of the first sliding rod; and a second fixing plate is fixedly connected to the left side of the bottom of the transmission sliding block, a transmission gear isrotatably connected into the protective shell, a limiting device is fixedly connected to the bottom of the right side of the inner wall of the protective shell, and a control device is fixedly connected to the right side of the bottom of the inner wall of the protective shell. The fixing mechanism is reasonable in structure and simple to operate, has very strong fixing strength, can be effectivelyregenerated, and can prevent a fixed digital-to-analog conversion chip from deviating during producing of the digital-to-analog conversion chip.

Description

technical field [0001] The invention relates to the technical field of a digital-to-analog conversion chip fixing mechanism, in particular to a fixing mechanism for digital-to-analog conversion chip production. Background technique [0002] After the transistor was invented and mass-produced, various solid-state semiconductor components such as diodes and transistors were widely used, replacing the function and role of vacuum tubes in circuits. In the middle and late 20th century, the progress of semiconductor manufacturing technology made integrated circuits possible. Compared with hand-assembled circuits using individual discrete electronic components, integrated circuits can integrate a large number of tiny transistors into a small chip, which is a huge improvement. The mass-manufacturability of integrated circuits, their reliability, and the modular approach to circuit design ensured the rapid adoption of standardized integrated circuits instead of designs using discret...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B25B11/00
CPCB25B11/00
Inventor 李爱夫胡封林
Owner HENGYANG TRANSISTOR