Alloy soft magnetic particle with high magnetic conductivity and low magnetic loss in microwave frequency band and preparation method of alloy soft magnetic particle
A technology with high magnetic permeability and microwave frequency band, which is applied in the direction of inductance/transformer/magnet manufacturing, inorganic material magnetism, metal material coating technology, etc., can solve the problem of reducing the application frequency band of soft magnetic composites, increasing high-frequency magnetization energy loss, Increase particle domain wall displacement damping and other issues to achieve high magnetic permeability, increased operating frequency, and low internal stress
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Embodiment 1
[0027] A clean Si sheet is selected as the base layer, and a layer of metal Al with a thickness of 100 nm is deposited on the Si sheet as a transition layer by means of magnetron sputtering. Continue sputtering to deposit a layer of FeCoB alloy with a thickness of 200nm on the Al layer; then coat a layer of reflective photoresist on the FeCoB, and cover a layer of mask on the photoresist by laser direct writing (periodical pattern with a diameter of 20um Arranged circular holes); expose the photoresist covered by the mask, so that the part of the photoresist that receives the light is exposed and deteriorated; then use the etching method to develop a pattern opposite to the mask on the photoresist; Use ion beam etching to etch away the part of FeCoB that is not covered by the photoresist; after the etching process is completed, place the whole material in acetone to dissolve the developed pattern formed by the photoresist, and then transfer it to NaOH The Al layer is etched aw...
Embodiment 2
[0029] A clean Si sheet is selected as the base layer, and a layer of metal Al with a thickness of 100 nm is deposited on the Si sheet as a transition layer by means of magnetron sputtering. Coat a layer of positive photoresist with a thickness of 500nm on the Al layer, and cover a layer of mask plate (periodically arranged circular holes with a diameter of 20um) on the photoresist by laser direct writing; The resist is exposed, so that the part of the photoresist that receives the light is exposed and deteriorated; then the photoresist is developed on the photoresist with the same pattern as the mask plate by the etching method; the developed pattern is grown by solution electroplating FeCo alloy; after the developed pattern is completely filled with FeCo alloy, place the whole material in acetone to dissolve the developed pattern formed by photoresist, and then transfer to NaOH solution to corrode the Al layer. At this time, the diameter is 20um , The FeCo alloy with a thick...
Embodiment 3
[0031] A clean Si sheet is selected as the base layer, and a layer of metal Al with a thickness of 100 nm is deposited on the Si sheet as a transition layer by means of magnetron sputtering. Coat a layer of positive photoresist with a thickness of 500nm on the Al layer, and cover a layer of mask plate (periodically arranged circular holes with a diameter of 20um) on the photoresist by laser direct writing; The resist is exposed, so that the part of the photoresist that receives the light is exposed and deteriorated; then the photoresist is developed on the photoresist with the same pattern as the mask plate by the etching method; the developed part is continued by magnetron sputtering FeNi alloy is sputtered in the pattern; after the developed pattern is completely filled with FeNi alloy, the whole material is placed in acetone to dissolve the developed pattern formed by the photoresist, and then transferred to NaOH solution to corrode the Al layer. , the FeNi alloy with a dia...
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