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stacked board

A circuit board, stacking technology, applied in the field of intelligent equipment, can solve the problems of open circuit danger and solder joints, and achieve the effect of avoiding false soldering.

Active Publication Date: 2022-06-07
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the position where the gas expands the cavity may be random, and the position of the expansion may cause the solder joint to form a false weld, or even have the risk of an open circuit

Method used

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Embodiment Construction

[0022] The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It is particularly pointed out that the following embodiments are only used to illustrate the present application, but do not limit the scope of the present application. Likewise, the following embodiments are only some of the embodiments of the present application, but not all of the embodiments, and all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0023] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor a separate or alternative embodiment that is mutua...

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Abstract

The application provides a stacked circuit board, which relates to the field of smart devices. In the stacked circuit board, the first and second circuit boards are arranged opposite to each other, and both the first and second circuit boards are used for welding electronic components; the intermediate circuit board is placed between the first and second circuit boards, and The second circuit board is stacked, and the middle part is provided with a through hole penetrating the first surface and the second surface. When the first and second circuit boards are stacked with the intermediate circuit board, the stacked circuit board forms an accommodation space at the through hole. A perforation is provided between the contacting part of the intermediate circuit board and one of the first and second circuit boards, and the perforation communicates with the containing space. The method provided by the present application can avoid the risk of the first and second circuit boards being stretched apart by the air in the accommodating space, and the design of the perforation can allow the heated gas to be discharged in time.

Description

technical field [0001] The present application relates to the field of smart devices, in particular to a stacked circuit board. Background technique [0002] When the circuit boards are stacked to increase the area of ​​the circuit boards that can place electronic components, because the stacked circuit boards form a cavity structure, when passing through a high-temperature furnace, the temperature inside the cavity rises, the gas expands, and the cavity The pressure builds up inside the body, propping up the stacked circuit boards. Only after the gas escapes through the opened gap can the pressure inside and outside the cavity be the same. However, the position of the gas to open the cavity may be random, and the position of the expansion may lead to the formation of virtual welding of the welding point, and even the danger of open circuit. SUMMARY OF THE INVENTION [0003] One aspect of the embodiments of the present application provides a stacked circuit board, includ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0298H05K1/0206
Inventor 刘幕俊
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD