A dual-frequency power divider based on substrate integrated coaxial line

Abstract

The invention discloses a dual-frequency power divider based on a substrate-integrated coaxial line, the structure of which is a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer and a The metal layer is divided into the first microstrip part, the substrate integrated coaxial part and the second microstrip part from left to right; the power divider adopts a T-junction power divider, and the main body is in the substrate integrated coaxial part , the input end is an impedance converter, the transmission lines of the two output ends are connected by two pairs of parallel coupling lines, and four parallel open-circuit stub lines are provided. The invention can be realized by multi-layer PCB technology, has simple structure, low cost and easy integration. Compared with the microstrip line with the same structure, the substrate-integrated coaxial line is a shielded structure, which can limit the energy radiation to the outside, reduce the loss, and at the same time avoid crosstalk between adjacent signals; Compared with the substrate integrated waveguide, the present invention uses TEM as the main mode, has no dispersion, has large working bandwidth and small volume.

Description

technical field [0001] The invention relates to a microwave and millimeter wave passive device, in particular to a dual-frequency power divider based on a substrate integrated coaxial line. Background technique [0002] With the continuous development of wireless communication technology, the requirements of communication systems for devices are getting higher and higher. How to reduce the volume, mass and cost of microwave components while maintaining the excellent characteristics of low loss and high power capacity has become a new challenge for researchers. [0003] In traditional microwave circuits, power dividers are mainly used in a single frequency band. However, with the continuous advancement of technology, communication frequency bands are becoming more and more crowded, and it will become a future development trend to be able to work in multiple frequency bands at the same time. In order to make full use of the limited spectrum resources, it is of great practical...

AI Technical Summary

Problems solved by technology

With the miniaturization of microwave circuits in the future, when integrated with other circuits, the microstrip power divider may interact with other circuit structures

Although the coaxial cavity power splitter has large power capacity and low loss, its structure size is large, and it is difficult to integrate with other structures

Substrate Integrated Waveguide (SIW) technology is a new waveguide junction integrated on a dielectric substrate with low insertion loss, low radiation, and high power capacity that has been proposed in the past ten years, but it has a cut-off wavelength, the volume is large, and it is also a dispersion structure, which is not suitable for applications in the broadband range

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