A kind of flexible uv-heat dual curing transparent conductive adhesive and preparation method thereof
A transparent conductive, dual-curing technology, used in conductive adhesives, adhesives, modified epoxy resin adhesives, etc., can solve the problems of poor heat resistance, low transparency, poor flexibility of conductive adhesives, and achieve good heat resistance. Effects of Sex and Flexibility
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0055] With 50 parts of self-made silicone block epoxy acrylate, 5 parts of n-butyl glycidyl ether, 4.5 parts of tetrahydrofuran methacrylate, 2.5 parts of 1-hydroxycyclohexyl benzophenone, 0.5 parts of bis( 2,4,6-Trimethylbenzoyl)phenylphosphine oxide, 0.5 parts of 3-glycidyloxypropyltriethoxysilane, 0.5 parts of 3-methacryloxypropylmethyl Dimethoxysilane was added to the stirred tank, and under the condition of vacuum and light protection, the revolution was 30 r / min, and the rotation was 800r / min, and the stirring was carried out for 30 minutes; 20 parts of a mixture of phthalic anhydride, the temperature is controlled not higher than 30°C, under the condition of vacuum and light protection, under the condition of revolution 30 r / min, stir for 30 minutes; add 14 parts of Ag nanowires, 6 parts of Ag nanoparticles, and control the temperature Not higher than 30°C, in a vacuum and protected from light, stir for 30 minutes under the condition of a revolution of 30 r / min; add 0....
Embodiment 2
[0059] 55 parts of self-made silicone block epoxy acrylate, 2.5 parts of glycidyl methacrylate, 2 parts of isobornyl methacrylate, 2.5 parts of 1-hydroxycyclohexyl benzophenone, 0.5 parts of 2 -Methyl-1-(4-methylthiophenyl)-2-morpholine-1-propanone, 0.5 parts of 3-glycidyloxypropyltrimethoxysilane, 0.5 parts of 3-methylpropene Add acyloxypropyl trimethoxysilane into the stirred tank, and in a vacuum, avoid light, and stir for 30 minutes under the conditions of revolution 30 r / min and rotation 800 r / min; add long-chain aliphatic dibasic acid polyanhydride and formaldehyde 20 parts of a mixture of hexahydrophthalic anhydride, the temperature is controlled not higher than 30 ° C, under the condition of revolution 30 r / min in a vacuum and protected from light, stir for 30 min; add 17.6 parts of Ag nanowires, 4.4 parts of Ag nanoparticles , control the temperature not higher than 30°C, under the condition of revolution 30 r / min, stir for 30min under the condition of vacuum and avoi...
Embodiment 3
[0063] 45 parts of self-made silicone block epoxy acrylate, 8 parts of trimethylolpropane triglycidyl ether, 5.5 parts of lauryl acrylate, 2.8 parts of 2-hydroxy-2-methyl- 1-Phenylacetone, 0.8 parts of bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 0.5 parts of 3-glycidyloxypropylmethyldimethoxysilane, 0.5 Parts of 3-methacryloyloxypropylmethyldiethoxysilane were added to the stirred tank, under the condition of vacuum and light protection, the revolution was 30 r / min, and the rotation was 800r / min, and the stirring was for 30 minutes; 20 parts of a mixture of dienyl succinic anhydride and methyl hexahydrophthalic anhydride, the temperature is controlled not higher than 30°C, and stirred for 30 minutes under the condition of a revolution of 30 r / min in a vacuum and protected from light; add Ag nanowires 20 parts, 5 parts of Ag nanoparticles, control the temperature not higher than 30°C, and stir for 30 minutes under the condition of revolution 30 r / min in a vacuum and avoid...
PUM
| Property | Measurement | Unit |
|---|---|---|
| epoxy equivalent | aaaaa | aaaaa |
| diameter | aaaaa | aaaaa |
| diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More