PCB electroplating control method, device, equipment and storage medium
A control method and current technology, applied in printed circuit manufacturing, electrolysis components, electrolysis process, etc., can solve the problem of excessive difference in plating thickness, and achieve the effect of reducing the difference in the thickness of electroplating copper and improving the accuracy
Active Publication Date: 2022-04-19
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology
[0002] At present, in the process of PCB electroplating processing, it is easy to cause the problem that the thickness of the plating layer in the PCB dense hole area and the plating thickness of the PCB isolated hole area, or the plating thickness of the PCB dense hole area and the plating thickness of the large copper skin of the PCB are too large.
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[0031] The conception and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments, so as to fully understand the purpose, features and effects of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to The protection scope of the present invention.
[0032] In the description of the embodiments of the present invention, if it involves "several", it means more than one, if it involves "multiple", it means more than two, if it involves "greater than", "less than", "more than ", should be understood as not including the original number, if it involves "above", "below", and "within", it should be understood as including the original number. If "first" and "second" are involved, it shou...
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The invention discloses a PCB electroplating control method, device, equipment and storage medium. The PCB electroplating control method includes: obtaining the electroplating current-related parameters corresponding to a plurality of first grids of the PCB; controlling the output signal of the second grid of the electroplating positive electrode corresponding to the first grid according to the electroplating current-related parameters, To control the electroplating of the PCB. According to the parameters related to the electroplating current of the PCB, the embodiment of the present invention performs different electroplating treatments on the first grid in different areas of the PCB, thereby reducing the difference between the electroplating copper thickness of the PCB dense hole area and the electroplating copper thickness of the PCB isolated hole area. The difference, or the difference between the electroplated copper thickness of the PCB dense hole area and the electroplated copper thickness of the PCB copper skin, and improves the accuracy of PCB electroplating.
Description
technical field [0001] The invention relates to the field of PCB electroplating, in particular to a PCB electroplating control method, device, equipment and storage medium. Background technique [0002] At present, in the process of PCB electroplating processing, it is easy to cause the problem that the thickness of the plating layer in the PCB dense hole area and the plating thickness of the PCB isolated hole area, or the plating thickness of the PCB dense hole area and the plating thickness of the large copper skin of the PCB are too large. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. For this reason, the present invention proposes a PCB electroplating control method, device, equipment and storage medium, which can reduce the difference in electroplating copper thickness and improve the accuracy of electroplating. [0004] In the first aspect, an embodiment of the present inventi...
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IPC IPC(8): C25D21/12H05K3/18
CPCC25D21/12H05K3/188
Inventor 罗畅刘湘龙余德源
Owner GUANGZHOU FASTPRINT CIRCUIT TECH