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Wafer table rotating and expanding structure

A technology of wafer table and expansion ring, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of complex parallel alignment of guide rails, difficult installation, and difficult to maintain accuracy, so as not to affect wafer processing and processing. The effect of precision, simple structure and convenient installation

Pending Publication Date: 2021-02-19
长园半导体设备(珠海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of large-scale guide rails makes it difficult to process the side of the wafer table, and the accuracy is not easy to maintain; and the parallel correction of the guide rails is complicated, the structure of the overall rotation and lifting device is complicated, and the installation is difficult

Method used

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  • Wafer table rotating and expanding structure
  • Wafer table rotating and expanding structure
  • Wafer table rotating and expanding structure

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Embodiment Construction

[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be another intermediate component through which it is fixed. When a component is said to be "connected" to another component, it can be directly connected to the other component or there may be another intermediate component present at the same time. When a component is said ...

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PUM

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Abstract

The invention discloses a wafer table rotating and expanding structure which comprises a bottom plate and an expanding ring. The expanding ring is installed on the bottom plate, the wafer table rotating and expanding structure further comprises a rotating piece, a bearing, a pressing module and a lifting driving piece, the expanding ring is connected with the rotating piece through the bearing, and the rotating piece drives the expanding ring to rotate relative to the bottom plate. The expanding ring is connected with the pressing module, the lifting driving piece is connected with the pressing module, the lifting driving piece drives the expanding ring to ascend and descend relative to the bottom plate through the pressing module, the wafer table can rotate and expand through the wafer table rotating and expanding structure, the structure is simple, installation is convenient, and wafer machining and machining precision are not affected.

Description

technical field [0001] The present invention relates to wafers, in particular to a rotation and expansion structure of a wafer table. Background technique [0002] During the overall packaging process of the wafer, a blue film is attached to the back of the entire wafer, and the blue film needs to be processed later to expand the blue film. After the blue film is expanded, the wafer needs to be rotated. Therefore, there is a need for a structure capable of both rotating and expanding the wafer table. In the prior art, large guide rails are generally used to limit the up and down movement. However, the use of large guide rails makes it difficult to process the side of the wafer table and maintain the accuracy; and the parallel correction of the guide rails is complicated, the overall rotation and lifting device structure is complex, and the installation is difficult. SUMMARY OF THE INVENTION [0003] In order to overcome the deficiencies of the prior art, the purpose of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/67
CPCH01L21/67126H01L21/68742H01L21/68792
Inventor 王慧蔡奇陵
Owner 长园半导体设备(珠海)有限公司