Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat dissipation and noise shielding combined structure of electronic device

An electronic device and combined structure technology, which is applied in the fields of magnetic field/electric field shielding, electrical equipment structural parts, electrical components, etc., can solve problems such as lack of cost design and insufficient space on circuit motherboards

Active Publication Date: 2021-02-23
SHENXUN COMP KUNSHAN +1
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Another object of the present invention is to provide a combination structure of heat dissipation and noise shielding for electronic devices, which can solve the shielding problem of radio frequency (RF) / electromagnetic compatibility (EMC) RF, and simultaneously solve the problem of the weight of the shielding cover, Those who have problems with lack of cost design and insufficient space on the circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation and noise shielding combined structure of electronic device
  • Heat dissipation and noise shielding combined structure of electronic device
  • Heat dissipation and noise shielding combined structure of electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] In order to have a further understanding and understanding of the features and achieved effects of the present invention, preferred embodiments and detailed descriptions are provided as follows.

[0028] The invention researches and develops the combination structure of heat dissipation and noise shielding of electronic devices, and solves the problem that the prior art cannot deal with noise shielding more effectively and simultaneously solves the problem of fast and massive heat dissipation.

[0029] Please refer to Figures 2 and 3, which are used to illustrate the heat dissipation and noise shielding combination structure of an electronic device of the present invention. In the disclosed embodiment, it includes: a circuit board device 10, a shielding heat dissipation structure 20 and a heat dissipation device 30 ; Wherein, the circuit board device 10 includes a circuit board 11, which is provided with a number of electronic components and equipment, in order to achiev...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a heat dissipation and noise shielding combined structure of an electronic device. The structure comprises a circuit board, a shielding pad body is formed on the surface of thecircuit board in a welding mode, and a shielding area is formed on the shielding pad body in a surrounding mode; an electronic element is arranged in the shielding area of the circuit board; and a shielding heat dissipation piece is fixedly arranged on the circuit board, the shielding heat dissipation piece is provided with a heat conducting plate, the periphery of the heat conducting plate extends towards the direction of the circuit board to form a connecting plate, the heat conducting plate is in contact with the electronic element, and the connecting plate is in contact with the shieldingpad body. Therefore, the correlation problem of a heat dissipation module and the radio frequency (RF) / electromagnetic compatibility (EMC) can be solved in an integrated mode, the excellent shieldingeffect and the rapid heat dissipation operation effect are achieved, and meanwhile the problems that the shielding cover body is lack of weight and cost design, and the space of a circuit mother board is insufficient can be solved.

Description

【Technical field】 [0001] The invention relates to a shielding structure, in particular to a heat dissipation and noise shielding combination structure for electronic devices that are aimed at shielding noise of electronic components and at the same time facilitate the operation and processing of electronic components that require rapid heat dissipation. 【Background technique】 [0002] At present, as 3C electronic products have more and more functions, many electronic components or electronic devices (such as high-speed solid state drives / SSDs, etc.) ) phenomenon makes the noise and electromagnetic interference of the system and the circuit board relatively increased, so all electronic equipment products need to be tested for electromagnetic interference (EMI / Electromagnetic Interference) and electromagnetic compatibility (EMC / Electromagnetic Compatibility), so that electronic components / devices Do not generate electromagnetic interference (EMI) to other equipment or the gene...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K7/20H05K9/00
CPCH05K7/205H05K9/0024
Inventor 吴启荣
Owner SHENXUN COMP KUNSHAN