Tin soldering device and system controller thereof

Abstract

The invention relates to a tin soldering device and a system controller thereof, wherein the tin soldering device comprises a light source, a tin soldering module, an optical guide assembly, a sensorand a feedback controller. The light source emits waveband light. The tin soldering module guides the waveband light to a to-be-soldered area to conduct heating for tin soldering. The optical guide assembly is arranged between the light source and the tin soldering module and guides the waveband light to the tin soldering module. The sensor is arranged at the other side of the optical guide assembly relative to the tin soldering module so as to receive sensing light beams and generate a sensing signal according to a sensing result of the sensing light beams, and the sensing light beams are guided to the sensor by the optical guide assembly. The feedback controller is connected with the sensor and the light source so as to receive the sensing signal and control the light source according tothe sensing signal. The optical guide assembly, the sensor and the feedback controller are integrated into the system controller, so that optical paths are coaxial, and the size and the weight of thetin soldering module are reduced.

Description

technical field [0001] The disclosure relates to a soldering device, in particular to a soldering module and a system controller thereof. Background technique [0002] Soldering process is one of the necessary operations in the production of electronic products. With the compaction of products and the limitation of traditional soldering equipment in mechanism or action, the traditional contact soldering method can no longer meet the current needs. The industry has developed a non-contact soldering process. type soldering method. [0003] Generally speaking, the existing non-contact soldering method uses a light source to heat the area to be soldered, and collects the sensing beam coaxially or non-coaxially with the light source, and uses the sensing result and / or feedback to control the The light source is controlled. [0004] However, regardless of whether the sensing beam is collected in a coaxial or non-coaxial manner, the conventional solder module is composed of optic...

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Problems solved by technology

[0004] However, regardless of whether the sensing beam is collected in a coaxial or non-coaxial manner, the previous solder module is composed of optical components and solder-related components, which often makes the overall bulky and cannot make the product compact or miniaturized

Among them, if the sensing beam is collected coaxially, the adjustment of the optical characteristics such as the optical path and the light spot is very complicated, and it takes a lot of time and labor costs; and if the sensing beam is collected non-coaxially, the Optical components will be more bulky

In addition, regardless of the coaxial or non-coaxial method, since the light source and the soldering module are installed independently, after a long period of operation, adjustment is required, and the accuracy is likely to be reduced due to tolerance or assembly problems; in addition, due to the soldering module Installed on a mobile carrier (such as a robotic arm), the optical path system often needs to be adjusted accordingly due to position movement, which is very inconvenient

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