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Photosensitive component, camera module and preparation method thereof

A technology for photosensitive components and camera modules, which is used in image communication, electrical components, printed circuit manufacturing, etc., and can solve the problems of oversized camera modules and chip deformation.

Pending Publication Date: 2021-02-26
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This has caused a series of technical problems, such as chip deformation problems, oversized camera modules, etc.

Method used

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  • Photosensitive component, camera module and preparation method thereof
  • Photosensitive component, camera module and preparation method thereof
  • Photosensitive component, camera module and preparation method thereof

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Embodiment Construction

[0070] Hereinafter, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. It should be understood that the present application is not limited by the exemplary embodiments described here.

[0071] Application overview

[0072] As mentioned above, as consumers have higher and higher requirements for the imaging quality of terminal equipment, the size of the photosensitive chip of the camera module is also gradually increasing, which has caused a series of technical problems, such as chip deformation, the size of the camera module, etc. Too big etc. Therefore, there is a need for improved camera module structural design and manufacturing solutions.

[0073] Specifically, the existing camera modules are usually assembled using the COB (Chip on ...

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Abstract

The invention relates to a photosensitive component and a camera module and a preparation method thereof. The photosensitive assembly comprises a photosensitive chip and a circuit board, wherein the circuit board comprises a circuit board main body and an ink layer formed on the circuit board main body. And the ink layer comprises a hollow area formed in a photosensitive chip mounting area of thecircuit board. The hollowed-out area is configured to apply an adhesive to the hollowed-out area, so that the photosensitive chip is bent downwards in the process that the photosensitive chip is attached to the circuit board through the adhesive. In this way, the bending state of the photosensitive chip is adjusted to improve the imaging quality of the photosensitive chip.

Description

technical field [0001] The present application relates to the field of camera modules, in particular to a photosensitive component, a camera module and a preparation method thereof. Background technique [0002] With the popularization of mobile electronic devices, related technologies of camera modules used in mobile electronic devices to help users acquire images (such as video or images) have developed rapidly and improved rapidly, and in recent years, camera modules Groups have been widely used in many fields such as medical treatment, security, industrial production and so on. [0003] As consumers have higher and higher requirements for imaging quality of mobile electronic devices (eg, smart phones), the size of photosensitive chips in camera modules is gradually increasing. This has caused a series of technical problems, such as chip deformation problems and oversized camera modules. Therefore, there is a need for improved camera module structural design and manufac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/32H05K3/30H04N5/225
CPCH05K3/325H05K3/305H04N23/54H04N23/55
Inventor 赵波杰郑程倡
Owner NINGBO SUNNY OPOTECH CO LTD