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Elastic membrane and substrate holding apparatus

A substrate holding and elastic film technology, applied in the direction of working carrier, grinding workpiece support, electrical components, etc., can solve the problems of poor uniformity of grinding rate, operator burden and labor increase, etc., and achieve the effect of easy installation

Pending Publication Date: 2021-03-05
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, if the deformation of the elastic film varies in the circumferential direction, the elastic film may not expand uniformly in its circumferential direction, and as a result, the uniformity of the polishing rate in the circumferential direction of the substrate may deteriorate.
[0014] In order to prevent the above-mentioned disadvantages, if the operator who fixes the elastic film to the head body tries to eliminate the variation in the deformation of the elastic film in the circumferential direction, the burden and labor of the operator will increase, and it will take a long time. Used to fix the elastic membrane to the head body

Method used

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  • Elastic membrane and substrate holding apparatus
  • Elastic membrane and substrate holding apparatus
  • Elastic membrane and substrate holding apparatus

Examples

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Embodiment Construction

[0083] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0084] figure 1 It is a figure which shows the grinding|polishing apparatus concerning one embodiment. Such as figure 1 As shown, the polishing apparatus includes a polishing table 18 that supports a polishing pad 19 , and a substrate holding device 1 that holds a wafer W as an example of a substrate and presses the wafer W against the polishing pad 19 on the polishing table 18 . In the following description, the substrate holding device 1 is referred to as "polishing head 1".

[0085] The grinding table 18 is connected to a device motor 29 disposed below the grinding table 18 via a device shaft 18a, and is rotatable around the device shaft 18a. The polishing pad 19 is attached to the upper surface of the polishing table 18, and the surface 19a of the polishing pad 19 constitutes a polishing surface for polishing the wafer W. A polishing liquid supply nozzle 25 is p...

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PUM

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Abstract

An elastic membrane capable of being easily secured to a head body of a substrate holding apparatus while inhibiting variation of a degree of deformation of the elastic membrane in a circumferential direction, and a substrate holding apparatus are disclosed. The elastic membrane (10) according to the present invention is used in the substrate holding apparatus (1). The elastic membrane (10) includes: a contact portion (11) to be brought into contact with a substrate (W) for pressing the substrate (W) against a polishing pad (19); and an edge circumferential wall (33) extending from a peripheral edge of the contact portion (11). The edge circumferential wall (33) includes an edge-circumferential-wall lip portion (33b) sandwiched between a head body (2) of the substrate holding apparatus (1)and an edge mounting member (47) for securing the edge circumferential wall (33) to the head body (2). The edge-circumferential-wall lip portion (33b) has at least a part of a surface thereof roughened.

Description

technical field [0001] The invention relates to an elastic membrane used in a substrate holding device of a polishing device. Furthermore, the present invention relates to a substrate holding device provided with an elastic film. Background technique [0002] A polishing apparatus for CMP includes a polishing table (Japanese: polishing table) for supporting a polishing pad, and a substrate holding device for holding a substrate such as a wafer. Substrate holders are also sometimes referred to as top rings or lapping heads. When polishing a substrate using such a polishing apparatus, the substrate is pressed against the polishing surface of the polishing pad with a predetermined pressure while the substrate is held by the substrate holding device. At this time, the surface of the substrate is polished by relatively moving the polishing table and the substrate holding device to bring the substrate into sliding contact with the polishing surface. [0003] When the relative p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/27
CPCB24B37/27B24B37/30B24B41/06H01L21/67092
Inventor 程诚富樫真吾福岛诚广川一人
Owner EBARA CORP