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Modified epoxy resin and application thereof

An epoxy resin and modification technology, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, electrical components, etc., can solve the complicated preparation methods, rheological characteristics and electrical properties of composite materials. To solve the problem, achieve the effect of improving anti-sagging ability, excellent rheological properties, and simple operation

Pending Publication Date: 2021-03-05
贵州振华电子信息产业技术研究有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this preparation method is relatively complicated, and the rheological properties and electrical properties of the composite material obtained cannot meet the requirements for preparing conductive silver paste.

Method used

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  • Modified epoxy resin and application thereof
  • Modified epoxy resin and application thereof
  • Modified epoxy resin and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1. Weigh 60g of liquid E-51 epoxy resin into a clean beaker, then add 30g of diethylene glycol butyl ether solution into it, place it on a digital constant temperature heating platform, set the temperature at 80°C, and at the same time, use 800rpm Stir at a rotating speed for 10 minutes to obtain a uniform resin solution.

[0028] 2. Slowly add 6g of fumed silica modifier and 30g of diethylene glycol butyl ether solution to the resin solution, raise the temperature of the heating table to 110°C, adjust the stirring speed to 1000rpm, and stir for 30min to obtain the modified E-51 ring oxygen resin.

Embodiment 2

[0030] 1. Weigh 60g of liquid Nanya NPEF-170 epoxy resin into a clean beaker, then add 15g of methyl nylon acid and 15g of diethylene glycol butyl ether solution into it, place it on a digital constant temperature heating platform, and set the temperature to 95° C., while stirring at a speed of 900 rpm for 10 minutes to obtain a uniform resin solution.

[0031] 2. Slowly add 7.5g of fumed silica modifier, 15g of methyl nylon acid and 15g of diethylene glycol butyl ether to the resin solution, raise the temperature of the heating table to 120°C, adjust the stirring speed to 1200rpm, and stir for 30min to obtain Modified NPEF-170 epoxy resin.

Embodiment 3

[0033] 1. Weigh 60g of liquid E-51 epoxy resin and put it into a clean beaker, then add 15g of diethylene glycol butyl ether solution and 15g of diethylene glycol ethyl ether acetate into it, and place it on a digital display constant temperature heating platform. Set it to 100°C, and at the same time, stir at a speed of 1200rpm for 15min to obtain a uniform resin solution.

[0034] 2. Slowly add 6g of fumed silica modifier, 15g of diethylene glycol butyl ether solution and 15g of diethylene glycol ethyl ether acetate into the resin solution, raise the temperature of the heating table to 120°C, and adjust the stirring speed to 900rpm, Stir for 50min to obtain modified E-51 epoxy resin.

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Abstract

The invention belongs to the technical field of high polymer material modification, and particularly relates to modified epoxy resin and application thereof. The epoxy resin is modified by adopting the modifier and adding the organic solvent for several times; the operation is simple, and the raw materials are easy to obtain, so that the settling velocity of the conductive silver paste prepared from the modified epoxy resin is 0.06 mm / d, the resistivity reaches 9.2 * 10<-5> ohm / cm, and the prepared paste is excellent in rheological property, good in electrical property, high in film hardness and good in electrical conductivity. Therefore, the modified epoxy resin is more suitable for application of electronic components in the aspects of dip-coating, bonding, sealing and the like.

Description

technical field [0001] The invention belongs to the technical field of polymer material modification, and in particular relates to a modified epoxy resin and its application. Background technique [0002] Epoxy resin is widely used in adhesives, electronic instruments, aerospace, conductive paste and electronic and electrical products due to its excellent adhesion, wear resistance, insulation, chemical stability, high temperature resistance and low cost. Insulation materials and other fields. Conductive silver paste is one of the most important materials in the field of electronics industry. It is widely used in the coating of printed circuit boards, dipping and bonding of electronic components, etc. Epoxy resin is the main raw material of conductive silver paste. Indispensable in preparation. [0003] In recent years, with the increasing demand for the miniaturization and light weight of electronic components, the requirements for conductive silver paste are also getting ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/36C08K3/34C08J3/21H01B1/22H01B13/00
CPCC08K3/36C08K3/346C08J3/212H01B1/22H01B13/00C08J2363/00C08L63/00
Inventor 张青华姜敬辉陈群星蒋松成安家芳
Owner 贵州振华电子信息产业技术研究有限公司