Heating pipeline and semiconductor manufacturing equipment
A technology for heating pipes and manufacturing equipment, which is applied to semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc. Good uniformity, avoids the effect of temperature cold spots
Pending Publication Date: 2021-03-05
CHANGXIN MEMORY TECH INC
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Problems solved by technology
First of all, during pipeline maintenance, the pipeline will be cleaned with acid solution, which requires removing the heating device, immersing the pipeline in the acid solution, and installing the heating device after cleaning. This maintenance process takes up A lot of maintenance time; secondly, in order to improve the heating effect of the pipeline, insulation cotton will be wrapped on the outside of the heating device, and during the heating process, the insulation cotton will melt and adhere to the heating block due to the influence of the temperature of the heating block. It is necessary to replace new insulation cotton and remove the insulation cotton adhered to the heating block from time to time. This maintenance process is very cumbersome, resulting in a lot of waste of manpower and material resources
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[0029] It can be seen from the background art that there is an urgent need to provide a heating pipeline, which can effectively heat the pipeline and improve maintenance efficiency.
[0030] It can be understood that the terms "first", "second" and the like used in the present invention may be used to describe various elements herein, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element. For example, a first quantity could be termed a second quantity, and, similarly, a second quantity could be termed a first quantity, without departing from the scope of the present invention. Both the first quantity and the second quantity are quantities, but they are not the same quantity.
[0031] In order to solve the above problems, the present invention provides a heating pipe, which uses carbon fiber braided wire as a heating structure to cover the outer wall of the inner pipe, and is used to heat the inner pipe aft...
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Abstract
The invention relates to a heating pipeline and semiconductor manufacturing equipment. The heating pipeline comprises an inner pipe and a heating structure wrapping the outer wall of the inner pipe; and the heating structure is used for heating the inner pipe after being powered on, and the heating structure is carbon fiber braided wires. While the inner pipe is effectively heated, the maintenanceefficiency is improved, and the production cost is saved.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a heating pipe and semiconductor manufacturing equipment. Background technique [0002] In the semiconductor manufacturing process, the semiconductor thin film deposition process is a key production technology. In the semiconductor thin film deposition process, it is necessary to use pipelines to introduce gaseous precursors into the reaction chamber, and it is necessary to maintain a relatively high temperature inside the pipeline during the introduction process. Installing a heating device outside the pipeline has become a common method in the semiconductor thin film deposition process. [0003] The heating device installed outside the pipeline is usually formed by connecting multiple heating blocks. First of all, during pipeline maintenance, the pipeline will be cleaned with acid solution, which requires removing the heating device, immersing the pipeline in the acid ...
Claims
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IPC IPC(8): H01L23/473
CPCH01L23/473
Inventor 王怀庆
Owner CHANGXIN MEMORY TECH INC