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Polyamic acid block copolymer and preparation method thereof, polyimide copper-clad plate and circuit board

A technology of block copolymer and polyamic acid, applied in circuit substrate materials, printed circuits, printed circuits, etc., can solve the problems of high dielectric loss, difficult to press, large deformation, etc., to improve processability, improve The effect of responsiveness

Active Publication Date: 2021-03-19
ZHEN DING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the bonding force between the existing polyimide film and the copper foil with low surface roughness is low. lower
Moreover, the existing polyimide film will be greatly deformed in hot pressing, and the softening temperature Ts is high, the toughness is poor, and it is not easy to press.
At the same time, the existing polyimide film has problems such as poor peel strength and high dielectric loss.

Method used

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  • Polyamic acid block copolymer and preparation method thereof, polyimide copper-clad plate and circuit board
  • Polyamic acid block copolymer and preparation method thereof, polyimide copper-clad plate and circuit board
  • Polyamic acid block copolymer and preparation method thereof, polyimide copper-clad plate and circuit board

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preparation example Construction

[0029] The embodiment of the present invention provides a kind of preparation method of polyamic acid block copolymer, comprises steps:

[0030] Step 1: providing a first dianhydride monomer and a second dianhydride monomer, the first dianhydride monomer and the second dianhydride monomer respectively include a liquid crystalline group and a flexible group.

[0031] Step 2: providing a first type of diamine monomer and a second type of diamine monomer, the first type of diamine monomer and the second type of diamine monomer respectively include a liquid crystal group and a flexible group.

[0032] Step 3: mixing the first dianhydride monomer and the second diamine monomer to condense them to form the first amide segment.

[0033] Step 4: mixing the second dianhydride monomer and the first diamine monomer to condense them to form a second amide segment.

[0034] Step 5: Mixing the first amide segment and the second amide segment to cause a copolymerization reaction to obtain t...

Embodiment 1

[0076]Add NMP (211.10g) and APAB (0.05mol, 11.41g) into a 500mL reaction bottle respectively, stir at high speed until dissolved, then add ODPA (0.05mol, 15.51g) and stir for 1 hour, then add TPE-M (0.05mol, 14.62g), after high-speed stirring until dissolved, then add TAHQ (0.05mol, 22.93g) and stir for 48 hours to complete the configuration of the polyamic acid block copolymer.

Embodiment 2

[0078] Add NMP (209.14g) and APAB (0.05mol, 11.41g) to a 500mL reaction bottle respectively, after stirring at high speed until dissolved, then add ODPA (0.025mol, 7.76g), BPADA (0.025mol, 13.01g) and stir to react After 1 hour, TPE-M (0.05mol, 14.62g) was added, and after stirring at high speed until dissolved, TAHQ (0.05mol, 22.93g) was added and stirred for 48 hours to complete the configuration of the polyamic acid block copolymer.

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Abstract

The invention provides a preparation method of a polyamide acid block copolymer. The preparation method comprises the following steps: providing a first dianhydride monomer and a second dianhydride monomer which respectively comprise a liquid crystal group and a flexible group; providing a first diamine monomer and a second diamine monomer, wherein the first diamine monomer and the second diaminemonomer respectively comprise a liquid crystalline group and a flexible group; mixing the first dianhydride monomer and the second diamine monomer to condense the first dianhydride monomer and the second diamine monomer so as to form a first amide segment; mixing the second dianhydride monomer and the first diamine monomer to condense the second dianhydride monomer and the first diamine monomer soas to form a second amide segment; and mixing the first amide chain segment and the second amide chain segment for a copolymerization reaction so as to obtain the polyamide acid block copolymer. Thepolyamic acid segmented copolymer is good in processability, good in electrical property and high in peel strength. In addition, the invention also provides the polyamide acid block copolymer, a polyimide copper-clad plate and a circuit board.

Description

technical field [0001] The invention relates to a polyamic acid block copolymer and a preparation method thereof. The polyimide copper-clad laminate prepared by cyclization of the polyamic acid block copolymer and the polyimide copper-clad laminate are prepared by using the polyimide copper-clad laminate. circuit board. Background technique [0002] In recent years, printed circuit boards have been widely used in various electronic products. At present, the copper clad laminates used to prepare printed circuit boards usually include copper foil, polyimide film, and glue between the copper foil and the polyimide film for bonding the copper foil and the polyimide film. sticky layer. [0003] However, the existing polyimide film has low bonding force to copper foil with low surface roughness. When using copper foil with low surface roughness to make copper clad laminate, the bonding force between copper foil and polyimide film lower. Moreover, the existing polyimide film wi...

Claims

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Application Information

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IPC IPC(8): C08G73/10H05K1/03
CPCC08G73/1071C08G73/1042H05K1/0346H05K2201/0141C08J2379/08C08J5/18C08G73/10C08F293/00C08J2377/06
Inventor 李冠纬苏赐祥向首睿吴佩蓉黄炜新
Owner ZHEN DING TECH CO LTD