Manufacturing method for circuit board
A manufacturing method and circuit board technology, which are applied in the directions of multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problem of inaccurate alignment of the inner conductive layer and the outer conductive layer, affecting the function of the circuit board, and improving the quality of the circuit board. rate reduction, etc.
Active Publication Date: 2021-03-19
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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Problems solved by technology
However, when building up a multi-layer circuit board, the fluidity of the liquid crystal polymer material increases greatly after high temperature and high pressure, resulting in the risk of inaccurate alignment or even misalignment between the inner conductive layer and the outer conductive layer, resulting in circuit board failure. Yield reduction or affect the function of the board
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[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
[0027] Some embodiments of the present invention will be described in detail below in conju...
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The invention provides a manufacturing method for a circuit board. The manufacturing method comprises the following steps that a circuit substrate is provided, wherein the circuit substrate comprisesat least one wiring area and waste areas arranged around the periphery of the wiring area, and at least one first vent hole penetrating through the waste areas is formed; a laminated board is arrangedon one side of the circuit substrate in a stacked mode in the penetrating direction of the first vent holes, a plurality of communicating holes are formed in the positions, corresponding to the wasteareas, of the first laminated board, each communicating hole penetrates through the waste areas of the circuit substrate and the first laminated board, and the communicating holes are distributed around the wiring area; the circuit substrate and the first laminated board are fixed through vacuum adsorption via the first vent holes, the communication holes are filled with thermosetting resin, andthen pre-baking is conducted so as to cure the thermosetting resin; the pre-baked first laminated board and the circuit substrate are laminated to form a first intermediate body; and areas, corresponding to the waste areas, in the first intermediate are removed so as to obtain at least one circuit board.
Description
technical field [0001] The invention relates to the field of circuit boards, in particular to a method for manufacturing a circuit board. Background technique [0002] At present, liquid crystal polymer materials (LCP) are widely used in the production of circuit boards because of their low moisture absorption, good chemical resistance, high gas barrier properties, and low dielectric constant / dielectric dissipation factor. However, when building up a multi-layer circuit board, the fluidity of the liquid crystal polymer material increases greatly after high temperature and high pressure, resulting in the risk of inaccurate alignment or even misalignment between the inner conductive layer and the outer conductive layer, resulting in circuit board failure. Yield decreases or affects the functionality of the board. Contents of the invention [0003] In view of this, it is necessary to provide a method for manufacturing a circuit board that improves alignment accuracy. [000...
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IPC IPC(8): H05K3/46H05K1/02
CPCH05K3/4632H05K1/0272H05K2203/1178
Inventor 魏豪毅李艳禄
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD