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Heat dissipation device for computer software and hardware technology development

A heat dissipation device, software and hardware technology, applied in the direction of computing, cleaning methods using tools, cleaning methods and utensils, can solve problems such as poor contact, affecting the effect of ventilation, affecting the efficiency of heat dissipation, etc., to reduce the use cost, heat dissipation Good effect, fast cooling effect

Inactive Publication Date: 2021-03-23
扎西(苏州)信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main part of the heat generated by the computer is the CPU and the graphics card, but the current heat dissipation methods are simply pasting the heat dissipation aluminum block on the CPU and installing a fan to dissipate heat, or directly through the fan to dissipate heat, and the heat dissipation effect is not good.
In addition, most fans are directly installed inside the chassis. When the fans are used, there will be wind circulation, which will attract a lot of dust to the fans and the CPU or graphics card. If it falls into the graphics card or CPU, it will cause poor contact, resulting in Use problems, a large amount of accumulation on the fan, affecting the effect of ventilation, thus affecting the efficiency of heat dissipation

Method used

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  • Heat dissipation device for computer software and hardware technology development
  • Heat dissipation device for computer software and hardware technology development
  • Heat dissipation device for computer software and hardware technology development

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see Figure 1-9 , in an embodiment of the present invention, a heat dissipation device for computer software and hardware technology development, comprising a heat sink 1, an outlet fan 2, an inlet fan 5 and an anti-ash module 4, the left end of the heat sink 1 is provided with an inlet fan 5, and the inlet fan The left end of 5 is provided with anti-ashing module 4, and the right end of heat sink 1 is provided with outlet fan 2, and inlet fan 5 and out...

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Abstract

The invention discloses a heat dissipation device for computer software and hardware technology development in the field of heat dissipation devices for computer development, which comprises a heat dissipation seat, an air outlet fan, an air inlet fan and a dustproof module, and is characterized in that the air inlet fan is arranged at the left end of the heat dissipation seat, the dustproof module is arranged at the left end of the air inlet fan, the air outlet fan is arranged at the right end of the heat dissipation seat, and the air inlet fan and the air outlet fan are fixedly connected tothe heat dissipation seat through bolts. The heat dissipation efficiency is high, and meanwhile, the influence of dust on heat dissipation can be reduced.

Description

technical field [0001] The invention relates to the field of heat dissipation devices for computer development, in particular to a heat dissipation device for computer software and hardware technology development. Background technique [0002] Computer technology refers to the technical methods and technical means used in the computer field, or refers to its hardware technology, software technology and application technology. Computer technology has obvious comprehensive characteristics. It is closely integrated with electronic engineering, applied physics, mechanical engineering, modern communication technology and mathematics, and develops rapidly. In the process of technology development, due to the large number of components inside the chassis and the continuous high-intensity operation, the internal heat is not easy to dissipate, so fans are installed in the chassis for heat dissipation. [0003] The main part of the heat generated by the computer is the CPU and the gr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20B08B1/04
CPCG06F1/183G06F1/20B08B1/32
Inventor 沈杰
Owner 扎西(苏州)信息科技有限公司